Issued Patents All Time
Showing 101–111 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7611825 | Photolithography method to prevent photoresist pattern collapse | Ching-Yu Chang, Bang-Ching Ho | 2009-11-03 |
| 7601466 | System and method for photolithography in semiconductor manufacturing | Yung-Sung Yen, Chia-Sui Hsu, Yuh-Sen Chang, Hsiao-Tzu Lu | 2009-10-13 |
| 7582538 | Method of overlay measurement for alignment of patterns in semiconductor manufacturing | Hsiao-Tzu Lu, Chin-Hsiang Lin, Hua-Shu Wu, Chia-Hsiang Lin | 2009-09-01 |
| 7501227 | System and method for photolithography in semiconductor manufacturing | Chin-Hsiang Lin, David Lu | 2009-03-10 |
| 7479466 | Method of heating semiconductor wafer to improve wafer flatness | Hsiao-Tzu Lu, Burn Jeng Lin, Chin-Hsiang Lin, Tsai-Sheng Gau | 2009-01-20 |
| 7387969 | Top patterned hardmask and method for patterning | George Liu, Vencent Chang, Norman Chen, Yao-Ching Ku, Chin-Hsiang Lin | 2008-06-17 |
| 7374956 | Method for improved metrology by protecting photoresist profiles | Shyeu Sheng Lu, Hong-Yuan Chu, Hua-Tai Lin | 2008-05-20 |
| 7339272 | Semiconductor device with scattering bars adjacent conductive lines | Chin-Hsiang Lin, Yung-Sung Yen, Chih-Ming Lai | 2008-03-04 |
| 7226873 | Method of improving via filling uniformity in isolated and dense via-pattern regions | Yung-Sung Yen, Chia-Hsiang Lin, Lawrence Lin, Tsung-Hsien Lin | 2007-06-05 |
| 7202148 | Method utilizing compensation features in semiconductor processing | Chin-Hsiang Lin, Chih-Cheng Chiu | 2007-04-10 |
| 6866988 | Methods for measuring photoresist dimensions | Shyue-Sheng Lu, Hong-Yuan Chu, Hua-Tai Lin | 2005-03-15 |