Issued Patents All Time
Showing 51–75 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347762 | Field effect transistor contact with reduced contact resistance using implantation process | Su-Hao Liu, Kuo-Ju Chen, Chun-Hung Wu, Liang-Yin Chen, Huicheng Chang +1 more | 2019-07-09 |
| 10347720 | Doping for semiconductor device with conductive feature | Su-Hao Liu, Huicheng Chang, Liang-Yin Chen, Kuo-Ju Chen, Chun-Hung Wu +4 more | 2019-07-09 |
| 10326003 | FinFET device and methods of forming | Huicheng Chang, Liang-Yin Chen, Chun-Feng Nieh, Li-Ting Wang, Wan-Yi Kao +1 more | 2019-06-18 |
| 10269921 | Fin field effect transistors having conformal oxide layers and methods of forming same | Liang-Yin Chen, Xiong-Fei Yu, Syun-Ming Jang, Hui-Cheng Chang, Meng-Shu Lin | 2019-04-23 |
| 10164066 | FinFET devices and methods of forming | Huicheng Chang, Liang-Yin Chen | 2018-12-25 |
| 10141266 | Method of fabricating semiconductor package structure | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-11-27 |
| 10128368 | Double gate trench power transistor and manufacturing method thereof | Po-Hsien Li, Jia-Fu Lin, Wei-Chieh Lin | 2018-11-13 |
| 10068842 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-09-04 |
| 10043757 | Semiconductor package structure and method of fabricating the same | Yu-Cheng Pai, Wei-Chung Hsiao, Shih-Chao Chiu, Chun-Hsien Lin, Ming-Chen Sun +1 more | 2018-08-07 |
| 10002825 | Method of fabricating package structure with an embedded electronic component | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-06-19 |
| 9991197 | Fabrication method of semiconductor package | Chi-Ching Ho, Shao-Tzu Tang, Yu Liu, Ying-Chou Tsai | 2018-06-05 |
| 9922827 | Method of forming a semiconductor structure | Liang-Gi Yao, Ta-Ming Kuan, Jeff J. Xu, Clement Hsingjen Wann | 2018-03-20 |
| 9899249 | Fabrication method of coreless packaging substrate | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2018-02-20 |
| 9893160 | Methods of forming gate dielectric material | Liang-Gi Yao, Clement Hsingjen Wann | 2018-02-13 |
| 9735080 | Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2017-08-15 |
| 9716060 | Package structure with an embedded electronic component and method of fabricating the package structure | Shih-Chao Chiu, Chun-Hsien Lin, Yu-Cheng Pai, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2017-07-25 |
| 9673140 | Package structure having a laminated release layer and method for fabricating the same | Ming-Chen Sun, Tzu-Chieh Shen, Shih-Chao Chiu, Wei-Chung Hsiao, Yu-Cheng Pai +1 more | 2017-06-06 |
| 9666302 | System and method for memory scan design-for-test | Ming-Hung Chang, Ching-Wei Wu | 2017-05-30 |
| 9564346 | Package carrier, semiconductor package, and process for fabricating same | Yuan-Chang Su, Shih-Fu Huang | 2017-02-07 |
| 9515188 | Fin field effect transistors having conformal oxide layers and methods of forming same | Meng-Shu Lin, Liang-Yin Chen, Xiong-Fei Yu, Hui-Cheng Chang, Syun-Ming Jang | 2016-12-06 |
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2016-11-29 |
| 9455025 | Static random access memory and method of controlling the same | Ching-Wei Wu, Ming-Hung Chang | 2016-09-27 |
| 9281311 | Memory cell array including a write-assist circuit and embedded coupling capacitor and method of forming same | Ching-Wei Wu, Wei-Shuo Kao, Kuang Ting Chen | 2016-03-08 |
| 9230622 | Simultaneous two/dual port access on 6T SRAM | Ching-Wei Wu, Kuang Ting Chen, Wei-Shuo Kao, Jui-Che Tsai | 2016-01-05 |
| 9196597 | Semiconductor package with single sided substrate design and manufacturing methods thereof | Yuan-Chang Su, Shih-Fu Huang, Tzu-Hui Chen, Kuang-Hsiung Chen, Pao-Ming Hsieh +2 more | 2015-11-24 |