Issued Patents All Time
Showing 26–50 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008506 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Chia-Shiung Tsai, Shih-Chang Liu, Xiaomeng Chen | 2018-06-26 |
| 9978754 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Chia-Shiung Tsai, Shih-Chang Liu, Xiaomeng Chen | 2018-05-22 |
| 9960129 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chih-Hui Huang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2018-05-01 |
| 9917130 | Image sensor with reduced optical path | Shyh-Fann Ting, Ching-Chun Wang, Jhy-Jyi Sze, Chun-Ming Su, Wei Chuang Wu +1 more | 2018-03-13 |
| 9871070 | Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensors | Tzu-Hsuan Hsu, Ching-Chun Wang, Chien-Hsien Tseng, Feng-Chi Hung, Wen-I Hsu | 2018-01-16 |
| 9853082 | Color filter array and micro-lens structure for imaging system | Szu-Ying Chen, Dun-Nian Yaung, Tzu-Hsuan Hsu | 2017-12-26 |
| 9825040 | Semiconductor arrangement with capacitor and method of fabricating the same | Chern-Yow Hsu, Ming Chyi Liu, Shih-Chang Liu, Chia-Shiung Tsai, Xiaomeng Chen | 2017-11-21 |
| 9805970 | Method for forming deep trench spacing isolation for CMOS image sensors | Tai-I Yang, Jung-I Lin, Ta-Chun Lin, Tien-Lu Lin | 2017-10-31 |
| 9786628 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2017-10-10 |
| 9559134 | Deep trench spacing isolation for complementary metal-oxide-semiconductor (CMOS) image sensors | Tai-I Yang, Jung-I Lin, Ta-Chun Lin, Tien-Lu Lin | 2017-01-31 |
| 9553096 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Xiaomeng Chen | 2017-01-24 |
| 9553095 | Capacitor and method for making same | Kuo-Chi Tu, Wen-Chuan Chiang | 2017-01-24 |
| 9508722 | Semiconductor arrangment with capacitor | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Xiaomeng Chen | 2016-11-29 |
| 9502396 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-11-22 |
| 9466663 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Xiaomeng Chen | 2016-10-11 |
| 9443796 | Air trench in packages incorporating hybrid bonding | Bruce C. S. Chou, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou, Xin-Hua Huang +4 more | 2016-09-13 |
| 9425247 | Metal-insulator-metal capacitor with current leakage protection | Huey-Chi Chu, Kuo-Ji Chen, Ming-Hsiang Song, Wen-Chuan Chiang | 2016-08-23 |
| 9425228 | Image sensor with reduced optical path | Shyh-Fann Ting, Ching-Chun Wang, Wei Chuang Wu, Yu-Jen Wang, Chun-Ming Su +1 more | 2016-08-23 |
| 9401395 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-07-26 |
| 9269762 | Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers | Kuo-Chyuan Tzeng, Luan C. Tran, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-02-23 |
| 9263415 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-02-16 |
| 9257409 | Decoupling MIM capacitor designs for interposers and methods of manufacture thereof | Kuo-Chyuan Tzeng, Kuo-Chi Tu, Hsiang-Fan Lee | 2016-02-09 |
| 9178008 | Metal-insulator-metal capacitor with current leakage protection | Kuo-Ji Chen, Wen-Chuan Chiang, Huey-Chi Chu, Ming-Hsiang Song | 2015-11-03 |
| 9142517 | Hybrid bonding mechanisms for semiconductor wafers | Ping-Yin Liu, Szu-Ying Chen, Chih-Hui Huang, Xin-Hua Huang, Lan-Lin Chao +3 more | 2015-09-22 |
| 9012967 | 1T MIM memory for embedded RAM application in soc | Yi-Ching Lin, Chun-Yao Chen, Shou-Gwo Wuu, Chung S. Wang, Chien-Hua Huang +2 more | 2015-04-21 |