AK

Alexander Kalnitsky

TSMC: 147 patents #132 of 12,232Top 2%
NS National Semiconductor: 46 patents #13 of 2,238Top 1%
IA Intersil Americas: 21 patents #10 of 468Top 3%
SS Stmicroelectronics Sa: 19 patents #57 of 1,676Top 4%
MP Maxim Integrated Products: 15 patents #23 of 945Top 3%
Nortel Networks Limited: 5 patents #562 of 5,294Top 15%
SS Sgs-Thomson Microelectronics S.A.: 5 patents #158 of 957Top 20%
UP Upek: 3 patents #3 of 13Top 25%
Apple: 3 patents #7,422 of 18,612Top 40%
📍 San Francisco, CA: #41 of 26,999 inventorsTop 1%
🗺 California: #309 of 386,348 inventorsTop 1%
Overall (All Time): #1,758 of 4,157,543Top 1%
262
Patents All Time

Issued Patents All Time

Showing 51–75 of 262 patents

Patent #TitleCo-InventorsDate
11387114 Semiconductor device with dummy gate and metal gate and method of fabricating the same Wei-Cheng Wu, Harry-Hak-Lay Chuang 2022-07-12
11335786 Gate structure in high-κ metal gate technology Wei-Cheng Wu, Shih-Hao Lo, Hung-Pin Ko 2022-05-17
11302691 High voltage integration for HKMG technology Kong-Beng Thei, Chien-Chih Chou, Fu-Jier Fan, Hsiao-Chin Tuan, Yi-Huan Chen +1 more 2022-04-12
11276684 Recessed composite capacitor Yi-Huan Chen, Chien-Chih Chou, Kong-Beng Thei 2022-03-15
11251314 Memory devices and methods of manufacture thereof Hsiao-Chin Tuan, Felix Ying-Kit Tsui, Hau-Yan Lu 2022-02-15
11251286 Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices Kong-Beng Thei, Chien-Chih Chou, Hsiao-Chin Tuan, Yi-Huan Chen 2022-02-15
11244857 Semiconductor structure and manufacturing method thereof Yung-Chih Tsai, Wei-Che Hsu, Yu Yang 2022-02-08
11189613 Semiconductor device Jia-Rui Lee, Kuo-Ming Wu, Yi-Chun Lin 2021-11-30
11189628 Trench gate high voltage transistor for embedded memory Wei-Cheng Wu, Chien-Hung Chang 2021-11-30
11171015 Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer Yu-Hung Cheng, Cheng-Ta Wu, Chen-Hao Chiang, Yeur-Luen Tu, Eugene Chen 2021-11-09
11139367 High density MIM capacitor structure Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Jung-I Lin, Jhy-Jyi Sze +3 more 2021-10-05
11133226 FUSI gated device formation Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Hsiao-Chin Tuan, Kong-Beng Thei +1 more 2021-09-28
11121038 Spacer structure and manufacturing method thereof Kong-Beng Thei 2021-09-14
11069652 Method of manufacturing semiconductor structure Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang, Ching-Hua Hsieh +9 more 2021-07-20
11063157 Trench capacitor profile to decrease substrate warpage Hsin-Li Cheng, Jyun-Ying Lin, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu +4 more 2021-07-13
11063081 Device over photodetector pixel sensor Jhy-Jyi Sze, Dun-Nian Yaung 2021-07-13
11063080 Implant damage free image sensor and method of the same Jhy-Jyi Sze, Dun-Nian Yaung, Chen-Jong Wang, Yimin Huang, Yuichiro Yamashita 2021-07-13
11063038 Through silicon via design for stacking integrated circuits Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more 2021-07-13
11049797 Method for manufacturing a semiconductor structure comprising a semiconductor device layer formed on a tem, porary substrate having a graded SiGe etch stop layer therebetween Yu-Hung Cheng, Shih Pei Chou, Yeur-Luen Tu, Tung-I Lin, Wei-Li Chen 2021-06-29
11043531 Semiconductor structure and manufacturing method of the same Sheng-Huang Huang, Harry-Hak-Lay Chuang, Jiunyu Tsai, Hung Cho Wang 2021-06-22
11037982 Semiconductor structure integrated with magnetic tunneling junction Harry-Hak-Lay Chuang, Sheng-Haung Huang, Tien-Wei Chiang 2021-06-15
11029714 Flipped gate current reference and method of using Mohammad Al-Shyoukh 2021-06-08
11011619 Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices Kong-Beng Thei, Chien-Chih Chou, Hsiao-Chin Tuan, Yi-Huan Chen 2021-05-18
10964692 Through silicon via design for stacking integrated circuits Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more 2021-03-30
10879200 Sidewall spacer to reduce bond pad necking and/or redistribution layer necking Kong-Beng Thei 2020-12-29