Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199139 | Trench capacitor film scheme to reduce substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Yingkit Felix Tsui, Shu-Hui Su, Shi-Min Wu | 2025-01-14 |
| 12176387 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2024-12-24 |
| 11769792 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2023-09-26 |
| 11159767 | Proactive in-call content recommendations for assistant systems | Sravani Kamisetty, Xiaolei Li, Yuan Chang | 2021-10-26 |
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2021-07-13 |
| 10693019 | Film scheme for a high density trench capacitor | Hsin-Li Cheng, Jyun-Ying Lin, Jing-Hwang Yang, Felix Ying-Kit Tsui, Yen-Wen Chen | 2020-06-23 |
| 9373627 | Multiple-time programming memory cells and methods for forming the same | Ching-Hung Fu, Chun-Yao Ko, Tuo-Hsin Chien | 2016-06-21 |
| 8962439 | Memory cell | Jyun-Ying Lin, Chun-Yao Ko | 2015-02-24 |
| 8952442 | Multiple-time programming memory cells and methods for forming the same | Ching-Hung Fu, Chun-Yao Ko, Tuo-Hsin Chien | 2015-02-10 |
| 8853079 | Fuse device | Jyun-Ying Lin, Chun-Yao Ko | 2014-10-07 |
| 8772854 | Multiple-time programming memory cells and methods for forming the same | Ching-Hung Fu, Chun-Yao Ko, Tuo-Hsin Chien | 2014-07-08 |
| 8653623 | One-time programmable devices and methods of forming the same | Jyun-Ying Lin, Chun-Yao Ko | 2014-02-18 |
| 5814893 | Semiconductor device having a bond pad | Edward O. Travis, Clifford M. Howard, Stephen G. Jamison | 1998-09-29 |
| 5707889 | Process for forming field isolation | Laureen H. Parker, David G. Kolar, Philip J. Tobin, Hsing-Huang Tseng, Lisa K. Garling +1 more | 1998-01-13 |
| 5661082 | Process for forming a semiconductor device having a bond pad | Edward O. Travis, Clifford M. Howard, Stephen G. Jamison | 1997-08-26 |
| 5589423 | Process for fabricating a non-silicided region in an integrated circuit | Ted R. White, Bradley M. Somero, Mark A. Chonko, Jung-Hui Lin | 1996-12-31 |
| 5580815 | Process for forming field isolation and a structure over a semiconductor substrate | Laureen H. Parker, David G. Kolar, Philip J. Tobin, Hsing-Huang Tseng, Lisa K. Garling +1 more | 1996-12-03 |