Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199139 | Trench capacitor film scheme to reduce substrate warpage | Ting-Chen Hsu, Hsin-Li Cheng, Jyun-Ying Lin, Yingkit Felix Tsui, Shu-Hui Su | 2025-01-14 |
| 12176387 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2024-12-24 |
| 11769792 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2023-09-26 |
| 11152462 | Semiconductor device having fins | Cong-Min Fang, Kang-Min Kuo | 2021-10-19 |
| 11063157 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su +4 more | 2021-07-13 |
| 10367059 | Method of manufacturing a semiconductor structure having a buried raised portion | Cong-Min Fang, Kang-Min Kuo | 2019-07-30 |
| 9761658 | Shallow trench isolation structure with raised portion between active areas and manufacturing method thereof | Cong-Min Fang, Kang-Min Kuo | 2017-09-12 |