Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8389332 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2013-03-05 |
| 8273602 | Integrated circuit package system with integration port | Henry Descalzo Bathan, Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2012-09-25 |
| 8269324 | Integrated circuit package system with chip on lead | Arnel Senosa Trasporto, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2012-09-18 |
| 8258012 | Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die | Reza A. Pagaila, Pandi C. Marimuthu | 2012-09-04 |
| 8258609 | Integrated circuit package system with lead support | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2012-09-04 |
| 8252634 | Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2012-08-28 |
| 8207600 | Integrated circuit package system with encapsulating features | Henry Descalzo Bathan, Jeffrey D. Punzalan, Abelardo Hadap Advincula | 2012-06-26 |
| 8067308 | Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Jae Hun Ku, Glenn Omandam, Hin Hwa Goh +1 more | 2011-11-29 |
| 8035204 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jae Hun Ku | 2011-10-11 |
| 8035207 | Stackable integrated circuit package system with recess | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-10-11 |
| 7998790 | Integrated circuit packaging system with isolated pads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-08-16 |
| 7977782 | Integrated circuit package system with dual connectivity | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Lionel Chien Hui Tay | 2011-07-12 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2011-06-21 |
| 7960815 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2011-06-14 |
| 7919360 | Integrated circuit packaging system with circuitry stacking and method of manufacture thereof | Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2011-04-05 |
| 7871863 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2011-01-18 |
| 7700404 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jae Hun Ku | 2010-04-20 |
| 7517733 | Leadframe design for QFN package with top terminal leads | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2009-04-14 |
| 7482683 | Integrated circuit encapsulation system with vent | Antonio B. Dimaano, Jr., Erick Dahilig, Sheila Marie L. Alvarez, Robinson Quiazon | 2009-01-27 |
| 7479409 | Integrated circuit package with elevated edge leadframe | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2009-01-20 |
| 7449369 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Jeffrey D. Punzalan | 2008-11-11 |
| 7443015 | Integrated circuit package system with downset lead | Jeffrey D. Punzalan, Sheila Marie L. Alvarez, Robinson Quiazon | 2008-10-28 |
| 7339258 | Dual row leadframe and fabrication method | Jeffrey D. Punzalan, Jae Hun Ku | 2008-03-04 |
| 7129569 | Large die package structures and fabrication method therefor | Jeffrey D. Punzalan, Jae Hun Ku | 2006-10-31 |
| 7060536 | Dual row leadframe and fabrication method | Jeffrey D. Punzalan, Jae Hun Ku | 2006-06-13 |