Issued Patents All Time
Showing 76–100 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7256075 | Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer | Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu, Yves Mathieu Le Vaillant | 2007-08-14 |
| 7235462 | Methods for fabricating a substrate | Fabrice Letertre | 2007-06-26 |
| 7235427 | Method for treating substrates for microelectronics and substrates obtained by said method | Thierry Barge, Toshiaki Iwamatsu, Hideki Naruoka, Junichiro Furihata, Kiyoshi Mitani | 2007-06-26 |
| 7232488 | Method of fabrication of a substrate for an epitaxial growth | Takeshi Akatsu, Cecile Aulnette | 2007-06-19 |
| 7169683 | Preventive treatment method for a multilayer semiconductor structure | Olivier Rayssac | 2007-01-30 |
| 7163873 | Substrate for stressed systems and method of making same | Fabrice Letertre, Olivier Rayssac | 2007-01-16 |
| 7145214 | Substrate for stressed systems and method of making same | Fabrice Letertre, Olivier Rayssac | 2006-12-05 |
| 7115481 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Cecile Aulnette, Benoit Bataillou, Carlos Mazure, Hubert Moriceau | 2006-10-03 |
| 7078353 | Indirect bonding with disappearance of bonding layer | Nicolas Daval, Cecile Aulnette, Oliver Rayssac, Ian Cayrefourcq | 2006-07-18 |
| 7071029 | Methods for fabricating final substrates | Fabrice Letertre | 2006-07-04 |
| 7067393 | Substrate assembly for stressed systems | Fabrice Letertre, Olivier Rayssac | 2006-06-27 |
| 7033905 | Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means | Cecile Aulnette, Bénédite Osternaud, Yves-Mathieu Vaillant, Takeshi Akatsu | 2006-04-25 |
| 7018910 | Transfer of a thin layer from a wafer comprising a buffer layer | Cecile Aulnette, Bénédite Osternaud | 2006-03-28 |
| 7017570 | Apparatus and method for splitting substrates | Thierry Barge, Walter Schwarzenbach, Jean-Marc Waechter, Thuan Truong | 2006-03-28 |
| 7018909 | Forming structures that include a relaxed or pseudo-relaxed layer on a substrate | Carlos Mazure, Emmanuel Arene | 2006-03-28 |
| 7018913 | Method for implanting atomic species through an uneven surface of a semiconductor layer | Takeshi Akatsu | 2006-03-28 |
| 7008857 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Cecile Aulnette, Bénédite Osternaud, Yves-Mathieu Vaillant, Takeshi Akatsu | 2006-03-07 |
| 7009270 | Substrate for stressed systems and method of making same | Fabrice Letertre, Oliver Rayssac | 2006-03-07 |
| 7001826 | Wafer with a relaxed useful layer and method of forming the wafer | Takeshi Akatsu | 2006-02-21 |
| 6991995 | Method of producing a semiconductor structure having at least one support substrate and an ultrathin layer | Cecile Aulnette, Benoit Bataillou, Hubert Moriceau | 2006-01-31 |
| 6991956 | Methods for transferring a thin layer from a wafer having a buffer layer | Cecile Aulnette, Bénédite Osternaud, Nicolas Daval | 2006-01-31 |
| 6982210 | Method for manufacturing a multilayer semiconductor structure that includes an irregular layer | Takeshi Akatsu | 2006-01-03 |
| 6974760 | Methods for transferring a useful layer of silicon carbide to a receiving substrate | Fabrice Letertre | 2005-12-13 |
| 6964914 | Method of manufacturing a free-standing substrate made of monocrystalline semi-conductor material | Fabrice Letertre, Carlos Mazure | 2005-11-15 |
| 6958284 | Method of smoothing the outline of a useful layer of material transferred onto a support substrate | — | 2005-10-25 |