Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615463 | Method for making thin layers containing microcomponents | Bernard Aspar, Christelle Lagahe | 2009-11-10 |
| 7602046 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu, Bruce Faure | 2009-10-13 |
| 7601611 | Method of fabricating a semiconductor hetero-structure | Ian Cayrefourcq, Fabrice Letertre | 2009-10-13 |
| 7586154 | Method for fabricating a substrate with useful layer on high resistivity support | Hubert Moriceau | 2009-09-08 |
| 7544586 | Method of fabricating chips and an associated support | Olivier Rayssac | 2009-06-09 |
| 7534701 | Process for transferring a layer of strained semiconductor material | Daniel Bensahel, Thomas Skotnicki | 2009-05-19 |
| 7510949 | Methods for producing a multilayer semiconductor structure | Carlos Mazure | 2009-03-31 |
| 7498245 | Embrittled substrate and method for making same | Bernard Aspar, Chrystelle Lagahe, Olivier Rayssac | 2009-03-03 |
| 7476930 | Multi-gate FET with multi-layer channel | Frédéric Allibert, Takeshi Akatsu | 2009-01-13 |
| 7465991 | Semiconductor substrates having useful and transfer layers | Fabrice Letertre | 2008-12-16 |
| 7422957 | Semiconductor substrates having useful and transfer layers | Fabrice Letertre | 2008-09-09 |
| 7407867 | Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate | Cecile Aulnette, Benoit Bataillou, Carlos Mazure, Hubert Moriceau | 2008-08-05 |
| 7407869 | Method for manufacturing a free-standing substrate made of monocrystalline semiconductor material | Fabrice Letertre, Carlos Mazure | 2008-08-05 |
| 7405135 | Substrate for stressed systems and method of making same | Fabrice Letertre, Olivier Rayssac | 2008-07-29 |
| 7378729 | Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom | Cecile Aulnette, Bénédite Osternaud, Yves Mathieu Le Vaillant, Takeshi Akatsu | 2008-05-27 |
| 7375008 | Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof | Cecile Aulnette, Bénédite Osternaud, Takeshi Akatsu, Bruce Faure | 2008-05-20 |
| 7348260 | Method for forming a relaxed or pseudo-relaxed useful layer on a substrate | — | 2008-03-25 |
| 7338883 | Process for transferring a layer of strained semiconductor material | Daniel Bensahel, Thomas Skotnicki | 2008-03-04 |
| 7288430 | Method of fabricating heteroepitaxial microstructures | Bruce Faure, Fabrice Letertre | 2007-10-30 |
| 7279779 | Substrate assembly for stressed systems | Fabrice Letertre, Olivier Rayssac | 2007-10-09 |
| 7268060 | Method for fabricating a substrate with useful layer on high resistivity support | Hubert Moriceau | 2007-09-11 |
| 7265029 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Olivier Rayssac | 2007-09-04 |
| 7265435 | Method for implanting atomic species through an uneven surface of a semiconductor layer | Takeshi Akatsu | 2007-09-04 |
| 7262113 | Methods for transferring a useful layer of silicon carbide to a receiving substrate | Fabrice Letertre | 2007-08-28 |
| 7256101 | Methods for preparing a semiconductor assembly | Fabrice Letertre, Olivier Rayssac | 2007-08-14 |