Issued Patents All Time
Showing 76–99 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7983020 | Carbon nanotube coated capacitor electrodes | Yongki Min | 2011-07-19 |
| 7947134 | Process for joining materials using bulk metallic glasses | Boonrat Lohwongwatana, Robert D. Conner, Jin-Yoo SUH, William L. Johnson | 2011-05-24 |
| 7867818 | Methods and apparatuses for providing stacked-die devices | Debendra Mallik | 2011-01-11 |
| 7745013 | Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same | Heeman Choe | 2010-06-29 |
| 7727814 | Microelectronic package interconnect and method of fabrication thereof | Amram Eitan, Yongki Min | 2010-06-01 |
| 7727815 | Reactive gettering in phase change solders to inhibit oxidation at contact surfaces | Chad A. Kumaus, Carl Deppisch, Ashay Dani | 2010-06-01 |
| 7713858 | Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same | Nachiket R. Raravikar | 2010-05-11 |
| 7710709 | Carbon nanotube coated capacitor electrodes | Yongki Min | 2010-05-04 |
| 7705458 | Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same | Yongki Min | 2010-04-27 |
| 7699210 | Soldering an electronics package to a motherboard | — | 2010-04-20 |
| 7700476 | Solder joint reliability in microelectronic packaging | Stephen Lehman, Mukul Renavikar | 2010-04-20 |
| 7666768 | Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance | Nachiket R. Raravikar, Leonel Arana, James C. Matayabas, Jr. | 2010-02-23 |
| 7628871 | Bulk metallic glass solder material | — | 2009-12-08 |
| 7629203 | Thermal interface material for combined reflow | Sabina J. Houle, Edward A. Zarbock | 2009-12-08 |
| 7578966 | Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith | — | 2009-08-25 |
| 7535099 | Sintered metallic thermal interface materials for microelectronic cooling assemblies | Chi Won Hwang | 2009-05-19 |
| 7402909 | Microelectronic package interconnect and method of fabrication thereof | Amram Eitan, Yongki Min | 2008-07-22 |
| 7371674 | Nanostructure-based package interconnect | Nachiket R. Raravikar | 2008-05-13 |
| 7357293 | Soldering an electronics package to a motherboard | — | 2008-04-15 |
| 7291548 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne, Edward L. Martin +4 more | 2007-11-06 |
| 7253088 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne, Edward L. Martin +4 more | 2007-08-07 |
| 7244634 | Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same | Saikumar Jayaraman, Mohd Erwan P. Bin Basiron, Sheau Hooi Lim, Yoong Tatt Chin | 2007-07-17 |
| 7224067 | Intermetallic solder with low melting point | — | 2007-05-29 |
| 7187068 | Methods and apparatuses for providing stacked-die devices | Debendra Mallik | 2007-03-06 |