Issued Patents All Time
Showing 51–75 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9218967 | Method for separating epitaxial layer from growth substrate | Kyu Ho Lee, Jong Min Jang, Chi Hyun In | 2015-12-22 |
| 9214420 | Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same | Nachiket R. Raravikar | 2015-12-15 |
| 9171976 | Light detection device | Ki Yon Park, Hwa Mok Kim, Young Hwan Son | 2015-10-27 |
| 9166092 | Light detection device | Ki Yon Park, Hwa Mok Kim, Young Hwan Son | 2015-10-20 |
| 9166093 | Photo detection device, photo detection package including the photo detection device, and portable device including the photo detection package | Ki Yon Park, Hwa Mok Kim, Young Hwan Son | 2015-10-20 |
| 9142480 | Microelectronic package with high temperature thermal interface material | Sabina J. Houle, Charles A. Hill | 2015-09-22 |
| 9123866 | Light emitting device having wide beam angle and method of fabricating the same | Jong Hyeon Chae, Chung Hoon Lee, Jong Min Jang, Joon Sup Lee, Won Young Roh +3 more | 2015-09-01 |
| 9093595 | Photo detection device | Ki Yon Park, Chang Suk Han, Hwa Mok Kim, Hyo Shik Choi | 2015-07-28 |
| 9059359 | Photo detection device, photo detection package including the photo detection device, and portable device including the photo detection package | Ki Yon Park, Hwa Mok Kim, Young Hwan Son | 2015-06-16 |
| 9059012 | Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the same | Jong Min Jang, Kyu Ho Lee, Chang Suk Han, Hwa Mok Kim, Chi Hyun In +1 more | 2015-06-16 |
| 9048348 | Method of separating substrate and method of fabricating semiconductor device using the same | Jong Min Jang, Hwa Mok Kim, Kyu Ho Lee, Chang Hoon Kim, Chi Hyun In +2 more | 2015-06-02 |
| 8916898 | Wafer level LED package and method of fabricating the same | Chung Hoon Lee | 2014-12-23 |
| 8901753 | Microelectronic package with self-heating interconnect | — | 2014-12-02 |
| 8558218 | Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivites and structures formed thereby | Nachiket R. Raravikar, Chris Matayabas | 2013-10-15 |
| 8436470 | Solder joint reliability in microelectronic packaging | Stephen Lehman, Mukul Renavikar | 2013-05-07 |
| 8409929 | Forming a semiconductor package including a thermal interface material | Mukul Renavikar, Carl Deppisch, Abhishek Gupta | 2013-04-02 |
| 8378504 | Microelectronic package with self-heating interconnect | — | 2013-02-19 |
| 8344483 | Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same | Nachiket R. Raravikar | 2013-01-01 |
| 8174113 | Methods of fabricating robust integrated heat spreader designs and structures formed thereby | Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Brad Drew | 2012-05-08 |
| 8158968 | Methods of forming carbon nanotubes architectures and composites with high electrical and thermal conductivities and structures formed thereby | Nachiket R. Raravikar, Chris Matayabas | 2012-04-17 |
| 8124517 | Method of forming an interconnect joint | Lakshmi Supriya | 2012-02-28 |
| 8100314 | Carbon nanotubes solder composite for high performance interconnect | — | 2012-01-24 |
| 8030757 | Forming a semiconductor package including a thermal interface material | Mukul Renavikar, Carl Deppisch, Abhishek Gupta | 2011-10-04 |
| 8018063 | Solder joint reliability in microelectronic packaging | Stephen Lehman, Mukul Renavikar | 2011-09-13 |
| 7986209 | Inductor using bulk metallic glass material | Chang-Min Park | 2011-07-26 |