Issued Patents All Time
Showing 651–675 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5946553 | Process for manufacturing a semiconductor package with bi-substrate die | Alan G. Wood, Warren M. Farnworth | 1999-08-31 |
| 5938956 | Circuit and method for heating an adhesive to package or rework a semiconductor die | David R. Hembree | 1999-08-17 |
| 5936305 | Stacked leads-over chip multi-chip module | — | 1999-08-10 |
| 5931685 | Interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, James M. Wark, Warren M. Farnworth, Alan G. Wood | 1999-08-03 |
| 5929647 | Method and apparatus for testing semiconductor dice | Alan G. Wood, David R. Hembree, Warren M. Farnworth | 1999-07-27 |
| 5929521 | Projected contact structure for bumped semiconductor device and resulting articles and assemblies | James M. Wark | 1999-07-27 |
| 5925930 | IC contacts with palladium layer and flexible conductive epoxy bumps | Warren M. Farnworth | 1999-07-20 |
| 5925410 | Vibration-enhanced spin-on film techniques for semiconductor device processing | Paul D. Shirley, William T. Rericha | 1999-07-20 |
| 5915977 | System and interconnect for making temporary electrical connections with bumped semiconductor components | David R. Hembree, John O. Jacobson, James M. Wark, Warren M. Farnworth, Alan G. Wood | 1999-06-29 |
| 5910043 | Polishing pad for chemical-mechanical planarization of a semiconductor wafer | Adam W. Manzonie | 1999-06-08 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 1999-05-25 |
| 5904546 | Method and apparatus for dicing semiconductor wafers | Alan G. Wood, Warren M. Farnworth | 1999-05-18 |
| 5904497 | Method and apparatus for semiconductor assembly which includes testing of chips and replacement of bad chips prior to final assembly | — | 1999-05-18 |
| 5903058 | Conductive bumps on die for flip chip application | — | 1999-05-11 |
| 5903044 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 1999-05-11 |
| 5899705 | Stacked leads-over chip multi-chip module | — | 1999-05-04 |
| 5898224 | Apparatus for packaging flip chip bare die on printed circuit boards | — | 1999-04-27 |
| 5895253 | Trench isolation for CMOS devices | — | 1999-04-20 |
| 5894161 | Interconnect with pressure sensing mechanism for testing semiconductor wafers | Warren M. Farnworth | 1999-04-13 |
| 5893966 | Method and apparatus for continuous processing of semiconductor wafers | David R. Hembree | 1999-04-13 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | Warren M. Farnworth, David R. Hembree, Derek Gochnour, John O. Jacobson, James M. Wark +1 more | 1999-04-13 |
| 5892281 | Tantalum-aluminum-nitrogen material for semiconductor devices | Scott Meikle | 1999-04-06 |
| 5891753 | Method and apparatus for packaging flip chip bare die on printed circuit boards | — | 1999-04-06 |
| 5869974 | Micromachined probe card having compliant contact members for testing semiconductor wafers | David R. Hembree, Alan G. Wood | 1999-02-09 |
| 5869787 | Electrically conductive projections | — | 1999-02-09 |