Issued Patents All Time
Showing 676–700 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5866953 | Packaged die on PCB with heat sink encapsulant | James M. Wark | 1999-02-02 |
| 5866460 | Method of forming a multiple inplant lightly doped drain (MILDD) field effect transistor | Akram Ditali | 1999-02-02 |
| D402638 | Temporary package for semiconductor dice | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 1998-12-15 |
| 5849635 | Semiconductor processing method of forming an insulating dielectric layer and a contact opening therein | Tyler Lowrey | 1998-12-15 |
| 5849633 | Electrically conductive projections and semiconductor processing method of forming same | — | 1998-12-15 |
| 5849435 | Method for forming a thin uniform layer of resist for lithography | Paul D. Shirley, William T. Rericha | 1998-12-15 |
| 5847445 | Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same | James M. Wark | 1998-12-08 |
| 5844419 | Method for testing semiconductor packages using decoupling capacitors to reduce noise | David R. Hembree, Alan G. Wood | 1998-12-01 |
| D401567 | Temporary package for semiconductor dice | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 1998-11-24 |
| 5838161 | Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect | David R. Hembree | 1998-11-17 |
| 5834945 | High speed temporary package and interconnect for testing semiconductor dice and method of fabrication | Alan G. Wood, Warren M. Farnworth | 1998-11-10 |
| 5834366 | Method for fabricating microbump interconnect for bare semiconductor dice | — | 1998-11-10 |
| 5817535 | LOC SIMM and method of fabrication | — | 1998-10-06 |
| 5815427 | Modular memory circuit and method for forming same | Eugene H. Cloud, Brent Keeth, James M. Shaffer, Alex Closson | 1998-09-29 |
| 5815000 | Method for testing semiconductor dice with conventionally sized temporary packages | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 1998-09-29 |
| 5809987 | Apparatus for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 1998-09-22 |
| 5811879 | Stacked leads-over-chip multi-chip module | — | 1998-09-22 |
| 5808360 | Microbump interconnect for bore semiconductor dice | — | 1998-09-15 |
| 5807762 | Multi-chip module system and method of fabrication | David R. Hembree, James M. Wark | 1998-09-15 |
| 5801452 | Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member | Warren M. Farnworth | 1998-09-01 |
| 5789278 | Method for fabricating chip modules | Alan G. Wood, Warren M. Farnworth | 1998-08-04 |
| 5789271 | Method for fabricating microbump interconnect for bare semiconductor dice | — | 1998-08-04 |
| 5766982 | Method and apparatus for underfill of bumped or raised die | James M. Wark | 1998-06-16 |
| D394844 | Temporary package for semiconductor dice | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 1998-06-02 |
| 5756370 | Compliant contact system with alignment structure for testing unpackaged semiconductor dice | Warren M. Farnworth | 1998-05-26 |