Issued Patents All Time
Showing 626–650 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6022750 | Method for fabricating semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect | David R. Hembree | 2000-02-08 |
| 6020624 | Semiconductor package with bi-substrate die | Alan G. Wood, Warren M. Farnworth | 2000-02-01 |
| 6018249 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Warren M. Farnworth, David R. Hembree | 2000-01-25 |
| 6016060 | Method, apparatus and system for testing bumped semiconductor components | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 2000-01-18 |
| 6013948 | Stackable chip scale semiconductor package with mating contacts on opposed surfaces | Alan G. Wood, Warren M. Farnworth | 2000-01-11 |
| 6008538 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | James M. Wark, David R. Hembree | 1999-12-28 |
| 6006739 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 1999-12-28 |
| 6005290 | Multi chip module having self limiting contact members | Warren M. Farnworth, Alan G. Wood | 1999-12-21 |
| 6005288 | Compliant contact system with alignment structure for testing unpackaged semiconductor device | Warren M. Farnworth | 1999-12-21 |
| 6002180 | Multi chip module with conductive adhesive layer | Alan G. Wood, Warren M. Farnworth | 1999-12-14 |
| 6002174 | Barrier materials for semiconductor devices | Scott Meikle | 1999-12-14 |
| 5998865 | LOC SIMM | — | 1999-12-07 |
| 5998274 | Method of forming a multiple implant lightly doped drain (MILDD) field effect transistor | Akram Ditali | 1999-12-07 |
| 5994166 | Method of constructing stacked packages | Jerry M. Brooks | 1999-11-30 |
| 5990694 | Integrated circuit probing method | — | 1999-11-23 |
| 5990566 | High density semiconductor package | Warren M. Farnworth, Alan G. Wood, Mike Brooks, Eugene H. Cloud | 1999-11-23 |
| 5982018 | Thin film capacitor coupons for memory modules and multi-chip modules | James M. Wark | 1999-11-09 |
| 5973404 | Underfill of bumped or raised die using a barrier adjacent to the sidewall of semiconductor device | James M. Wark | 1999-10-26 |
| 5962921 | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | Warren M. Farnworth, Derek Gochnour | 1999-10-05 |
| 5959310 | Multi-chip module system | David R. Hembree, James M. Wark | 1999-09-28 |
| 5956605 | Use of nitrides for flip-chip encapsulation | Warren M. Farnworth | 1999-09-21 |
| 5952840 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, John O. Jacobson | 1999-09-14 |
| 5950613 | Apparatus and method for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 1999-09-14 |
| 5949241 | Method for testing interconnects and semiconductor dice | Warren M. Farnworth | 1999-09-07 |
| 5949242 | Method and apparatus for testing unpackaged semiconductor dice | Alan G. Wood, Warren M. Farnworth, David R. Hembree | 1999-09-07 |