Issued Patents All Time
Showing 601–625 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6072236 | Micromachined chip scale package | David R. Hembree, Warren M. Farnworth | 2000-06-06 |
| 6072321 | Micromachined silicon probe card for semiconductor dice and method of fabrication | David R. Hembree, Alan G. Wood | 2000-06-06 |
| 6072323 | Temporary package, and method system for testing semiconductor dice having backside electrodes | David R. Hembree, Warren M. Farnworth, James M. Wark | 2000-06-06 |
| 6067977 | Apparatus and method for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 2000-05-30 |
| 6068669 | Compliant interconnect for testing a semiconductor die | Warren M. Farnworth, Alan G. Wood | 2000-05-30 |
| 6066509 | Method and apparatus for underfill of bumped or raised die | James M. Wark | 2000-05-23 |
| 6064216 | Apparatus for testing semiconductor wafers | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, John O. Jacobson | 2000-05-16 |
| 6064116 | Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications | — | 2000-05-16 |
| 6060894 | Temporary package, method and system for testing semiconductor dice having backside electrodes | David R. Hembree, Warren M. Farnworth, James M. Wark | 2000-05-09 |
| 6060893 | Carrier having slide connectors for testing unpackaged semiconductor dice | Warren M. Farnworth, Mike Brooks | 2000-05-09 |
| 6060891 | Probe card for semiconductor wafers and method and system for testing wafers | David R. Hembree, Warren M. Farnworth, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2000-05-09 |
| 6060339 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | James M. Wark, David R. Hembree | 2000-05-09 |
| 6057597 | Semiconductor package with pre-fabricated cover | Warren M. Farnworth, David R. Hembree, Derek Gochnour, John O. Jacobson, James M. Wark +1 more | 2000-05-02 |
| 6051878 | Method of constructing stacked packages | Jerry M. Brooks | 2000-04-18 |
| 6048656 | Void-free underfill of surface mounted chips | Tongbi Jiang | 2000-04-11 |
| 6040702 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Derek Gochnour | 2000-03-21 |
| 6040618 | Multi-chip module employing a carrier substrate with micromachined alignment structures and method of forming | — | 2000-03-21 |
| 6040239 | Non-oxidizing touch contact interconnect for semiconductor test systems and method of fabrication | Warren M. Farnworth | 2000-03-21 |
| 6037667 | Socket assembly for use with solder ball | David R. Hembree | 2000-03-14 |
| 6033548 | Rotating system and method for electrodepositing materials on semiconductor wafers | David R. Hembree | 2000-03-07 |
| 6028436 | Method for forming coaxial silicon interconnects | David R. Hembree, Alan G. Wood | 2000-02-22 |
| 6028365 | Integrated circuit package and method of fabrication | Warren M. Farnworth | 2000-02-22 |
| 6025731 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Warren M. Farnworth, Alan G. Wood, James M. Wark, Derek Gochnour | 2000-02-15 |
| 6025730 | Direct connect interconnect for testing semiconductor dice and wafers | James M. Wark, Warren M. Farnworth | 2000-02-15 |
| 6025728 | Semiconductor package with wire bond protective member | David R. Hembree, Derek Gochnour, Warren M. Farnworth | 2000-02-15 |