Issued Patents All Time
Showing 576–600 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6121070 | Flip chip down-bond: method and apparatus | — | 2000-09-19 |
| 6119675 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2000-09-19 |
| 6119255 | Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit | — | 2000-09-12 |
| 6114770 | Low profile semiconductor package | Larry D. Kinsman | 2000-09-05 |
| 6114240 | Method for fabricating semiconductor components using focused laser beam | Warren M. Farnworth, Alan G. Wood | 2000-09-05 |
| 6112740 | Method for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 2000-09-05 |
| 6111220 | Circuit and method for heating an adhesive to package or rework a semiconductor die | David R. Hambree | 2000-08-29 |
| 6107122 | Direct die contact (DDC) semiconductor package | Alan G. Wood, Warren M. Farnworth, Ford B. Grigg | 2000-08-22 |
| 6107109 | Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate | Warren M. Farnworth, Alan G. Wood | 2000-08-22 |
| 6104089 | Stacked leads-over chip multi-chip module | — | 2000-08-15 |
| 6103613 | Method for fabricating semiconductor components with high aspect ratio features | — | 2000-08-15 |
| 6100175 | Method and apparatus for aligning and attaching balls to a substrate | Alan G. Wood, Mike Hess, David R. Hembree | 2000-08-08 |
| 6093643 | Electrically conductive projections and semiconductor processing method of forming same | — | 2000-07-25 |
| 6094058 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Warren M. Farnworth, Alan G. Wood | 2000-07-25 |
| 6089920 | Modular die sockets with flexible interconnects for packaging bare semiconductor die | Warren M. Farnworth, David J. Corisis | 2000-07-18 |
| 6091143 | Stacked leads-over chip multi-chip module | — | 2000-07-18 |
| 6091252 | Method, apparatus and system for testing bumped semiconductor components | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 2000-07-18 |
| 6087676 | Multi-chip module system | David R. Hembree, James M. Wark | 2000-07-11 |
| 6083376 | Rotating system for electrochemical treatment of semiconductor wafers | David R. Hembree | 2000-07-04 |
| 6084288 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 2000-07-04 |
| 6081027 | Integrated heat sink | — | 2000-06-27 |
| 6081463 | Semiconductor memory remapping | James M. Shaffer, Brent Keeth, Eugene H. Cloud | 2000-06-27 |
| 6077723 | Method for fabricating a multi chip module with alignment member | Warren M. Farnworth | 2000-06-20 |
| 6075288 | Semiconductor package having interlocking heat sinks and method of fabrication | — | 2000-06-13 |
| 6072326 | System for testing semiconductor components | David R. Hembree, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2000-06-06 |