Issued Patents All Time
Showing 526–550 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6239590 | Calibration target for calibrating semiconductor wafer test systems | Andrew J. Krivy, Warren M. Farnworth, David R. Hembree, James M. Wark, John O. Jacobson | 2001-05-29 |
| 6235630 | Silicide pattern structures and methods of fabricating the same | Y. Jeff Hu | 2001-05-22 |
| 6235554 | Method for fabricating stackable chip scale semiconductor package | Alan G. Wood, Warren M. Farnworth | 2001-05-22 |
| 6232243 | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | Warren M. Farnworth, Derek Gochnour | 2001-05-15 |
| 6228687 | Wafer-level package and methods of fabricating | Alan G. Wood | 2001-05-08 |
| 6229324 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Warren M. Farnworth, David R. Hembree | 2001-05-08 |
| 6224713 | Method and apparatus for ultrasonic wet etching of silicon | David R. Hembree | 2001-05-01 |
| 6222265 | Method of constructing stacked packages | Jerry M. Brooks | 2001-04-24 |
| 6222379 | Conventionally sized temporary package for testing semiconductor dice | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 2001-04-24 |
| 6222280 | Test interconnect for semiconductor components having bumped and planar contacts | Warren M. Farnworth | 2001-04-24 |
| 6218259 | Capacitor and method for forming the same | — | 2001-04-17 |
| 6218848 | Semiconductor probe card having resistance measuring circuitry and method of fabrication | David R. Hembree | 2001-04-17 |
| 6214641 | Method of fabricating a multi-chip module | — | 2001-04-10 |
| 6214635 | Method and apparatus for underfill of bumped or raised die | James M. Wark | 2001-04-10 |
| 6215322 | Conventionally sized temporary package for testing semiconductor dice | Warren M. Farnworth, Alan G. Wood, David R. Hembree | 2001-04-10 |
| 6215181 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | James M. Wark, David R. Hembree | 2001-04-10 |
| 6214716 | Semiconductor substrate-based BGA interconnection and methods of farication same | — | 2001-04-10 |
| 6210993 | High density semiconductor package and method of fabrication | Warren M. Farnworth, Alan G. Wood, Mike Brooks, Eugene H. Cloud | 2001-04-03 |
| 6208157 | Method for testing semiconductor components | David R. Hembree, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2001-03-27 |
| 6207548 | Method for fabricating a micromachined chip scale package | David R. Hembree, Warren M. Farnworth | 2001-03-27 |
| 6204678 | Direct connect interconnect for testing semiconductor dice and wafers | James M. Wark, Warren M. Farnworth | 2001-03-20 |
| 6196096 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2001-03-06 |
| 6194243 | Method of production an underfill of a bumped or raised die using a barrier adjacent to the sidewall of a semiconductor device | James M. Wark | 2001-02-27 |
| 6190945 | Integrated heat sink | — | 2001-02-20 |
| 6189120 | Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit | — | 2001-02-13 |