Issued Patents All Time
Showing 501–525 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6279563 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2001-08-28 |
| 6278286 | Interconnect and system for making temporary electrical connections to semiconductor components | Warren M. Farnworth | 2001-08-21 |
| 6277262 | Method and apparatus for continuous processing of semiconductor wafers | David R. Hembree | 2001-08-21 |
| 6274390 | Method and apparatus providing redundancy for fabricating highly reliable memory modules | James M. Wark, David R. Hembree | 2001-08-14 |
| 6275052 | Probe card and testing method for semiconductor wafers | David R. Hembree, Warren M. Farnworth, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2001-08-14 |
| 6271590 | Graded layer for use in semiconductor circuits and method for making same | Scott Meikle | 2001-08-07 |
| 6268650 | Semiconductor device, ball grid array connection system, and method of making | Larry D. Kinsman | 2001-07-31 |
| 6265245 | Compliant interconnect for testing a semiconductor die | Warren M. Farnworth, Alan G. Wood | 2001-07-24 |
| 6261913 | Method for using thin spacers and oxidation in gate oxides | Mohamed A. Ditali | 2001-07-17 |
| 6261865 | Multi chip semiconductor package and method of construction | — | 2001-07-17 |
| 6261854 | Interconnect with pressure sensing mechanism for testing semiconductor wafers | Warren M. Farnworth | 2001-07-17 |
| 6255840 | Semiconductor package with wire bond protective member | David R. Hembree, Derek Gochnour, Warren M. Farnworth | 2001-07-03 |
| 6255833 | Method for testing semiconductor dice and chip scale packages | Alan G. Wood, David R. Hembree, Warren M. Farnworth | 2001-07-03 |
| 6255213 | Method of forming a structure upon a semiconductive substrate | — | 2001-07-03 |
| 6255196 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2001-07-03 |
| 6253758 | Apparatus for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 2001-07-03 |
| 6253755 | Method for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 2001-07-03 |
| 6250192 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2001-06-26 |
| 6252308 | Packaged die PCB with heat sink encapsulant | James M. Wark | 2001-06-26 |
| 6248429 | Metallized recess in a substrate | John R. C. Futrell, Steven M. McDonald | 2001-06-19 |
| 6248962 | Electrically conductive projections of the same material as their substrate | — | 2001-06-19 |
| 6246245 | Probe card, test method and test system for semiconductor wafers | C. Patrick Doherty, Warren M. Farnworth, David R. Hembree | 2001-06-12 |
| 6246250 | Probe card having on-board multiplex circuitry for expanding tester resources | C. Patrick Doherty, Jorge L. deVarona | 2001-06-12 |
| 6245594 | Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly | Zhiqiang Wu, Tongbi Jiang | 2001-06-12 |
| 6242935 | Interconnect for testing semiconductor components and method of fabrication | — | 2001-06-05 |