Issued Patents All Time
Showing 451–475 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365967 | Interconnect structure | David R. Hembree | 2002-04-02 |
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2002-03-26 |
| 6362637 | Apparatus for testing semiconductor wafers including base with contact members and terminal contacts | Warren M. Farnworth, Alan G. Wood, David R. Hembree, James M. Wark, John O. Jacobson | 2002-03-26 |
| 6358833 | Method of fabricating a micromachined chip scale package | David R. Hembree, Warren M. Farnworth | 2002-03-19 |
| 6359456 | Probe card and test system for semiconductor wafers | David R. Hembree, Warren M. Farnworth, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2002-03-19 |
| 6356092 | Method and apparatus for capacitively testing a semiconductor die | Warren M. Farnworth | 2002-03-12 |
| 6356098 | Probe card, test method and test system for semiconductor wafers | C. Patrick Doherty, Warren M. Farnworth, David R. Hembree | 2002-03-12 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2002-03-05 |
| 6353328 | Test system with mechanical alignment for semiconductor chip scale packages and dice | Warren M. Farnworth, David R. Hembree | 2002-03-05 |
| 6351028 | Multiple die stack apparatus employing T-shaped interposer elements | — | 2002-02-26 |
| 6349396 | Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit | — | 2002-02-19 |
| 6342724 | Thin film capacitor coupons for memory modules and multi-chip modules | James M. Wark | 2002-01-29 |
| 6338880 | Chemical vapor deposition process for depositing titanium nitride films from an organometallic compound | — | 2002-01-15 |
| 6339210 | Circuit and method for heating an adhesive to package or rework a semiconductor die | David R. Hembree | 2002-01-15 |
| 6339256 | Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications | — | 2002-01-15 |
| 6337575 | Methods of testing integrated circuitry, methods of forming tester substrates, and circuitry testing substrates | — | 2002-01-08 |
| 6337577 | Interconnect and system for testing bumped semiconductor components with on-board multiplex circuitry for expanding tester resources | C. Patrick Doherty, Jorge L. deVarona | 2002-01-08 |
| 6335230 | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure | — | 2002-01-01 |
| 6333555 | Interconnect for semiconductor components and method of fabrication | Warren M. Farnworth | 2001-12-25 |
| 6330158 | Semiconductor package having heat sinks and method of fabrication | — | 2001-12-11 |
| 6329829 | Interconnect and system for making temporary electrical connections to semiconductor components | Warren M. Farnworth | 2001-12-11 |
| 6329828 | Method and apparatus for capacitively testing a semiconductor die | Warren M. Farnworth | 2001-12-11 |
| 6329712 | High density flip chip memory arrays | Warren M. Farnworth, Alan G. Wood | 2001-12-11 |
| 6326698 | Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices | — | 2001-12-04 |
| 6320253 | Semiconductor device comprising a socket and method for forming same | Larry D. Kinsman | 2001-11-20 |