Issued Patents All Time
Showing 426–450 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6407451 | Micromachined chip scale package | David R. Hembree, Warren M. Farnworth | 2002-06-18 |
| 6407570 | Interconnect for testing semiconductor components having support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, James M. Wark, John O. Jacobson | 2002-06-18 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2002-06-11 |
| 6404044 | Semiconductor package with stacked substrates and multiple semiconductor dice | Jerry M. Brooks | 2002-06-11 |
| 6404048 | Heat dissipating microelectronic package | — | 2002-06-11 |
| 6404057 | Tantalum - aluminum - nitrogen material for semiconductor devices | Scott Meikle | 2002-06-11 |
| 6400032 | Method and apparatus for packaging flip chip bare die on printed circuit boards | — | 2002-06-04 |
| 6400172 | Semiconductor components having lasered machined conductive vias | Warren M. Farnworth, Alan G. Wood | 2002-06-04 |
| 6400174 | Test system having alignment member for aligning semiconductor components | Warren M. Farnworth, Michael E. Hess, David R. Hembree | 2002-06-04 |
| 6396291 | Method for testing semiconductor components | David R. Hembree, Warren M. Farnworth, Derek Gochnour, Alan G. Wood, John O. Jacobson | 2002-05-28 |
| 6395565 | Multi-chip module system and method of fabrication | David R. Hembree, James M. Wark | 2002-05-28 |
| 6396292 | Test carrier with decoupling capacitors for testing semiconductor components | David R. Hembree | 2002-05-28 |
| 6392429 | Temporary semiconductor package having dense array external contacts | David R. Hembree, Warren M. Farnworth, Alan G. Wood | 2002-05-21 |
| 6392430 | Method of forming coaxial silicon interconnects | David R. Hembree, Alan G. Wood | 2002-05-21 |
| 6388458 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | David R. Hembree, Derek Gochnour | 2002-05-14 |
| 6387732 | Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby | — | 2002-05-14 |
| 6383881 | Method for using thin spacers and oxidation in gate oxides | Mohamed A. Ditali | 2002-05-07 |
| 6376918 | Underfill of a bumped or raised die utilizing a barrier adjacent to the side wall of slip chip | James M. Wark | 2002-04-23 |
| 6373273 | Test insert containing vias for interfacing a device containing contact bumps with a test substrate | David R. Hembree | 2002-04-16 |
| 6372552 | Semiconductor device, ball grid array connection system, and method of making | Larry D. Kinsman | 2002-04-16 |
| 6369597 | Method and apparatus for capacitively testing a semiconductor die | Warren M. Farnworth | 2002-04-09 |
| 6369600 | Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure | Warren M. Farnworth, Mike Hess, David R. Hembree, James M. Wark, John O. Jacobson | 2002-04-09 |
| 6366112 | Probe card having on-board multiplex circuitry for expanding tester resources | C. Patrick Doherty, Jorge L. deVarona | 2002-04-02 |
| 6364196 | Method and apparatus for aligning and attaching balls to a substrate | Alan G. Wood, Mike Hess, David R. Hembree | 2002-04-02 |
| 6365952 | Trench isolation for CMOS devices | — | 2002-04-02 |