Issued Patents All Time
Showing 476–500 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6320203 | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure | — | 2001-11-20 |
| 6319065 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2001-11-20 |
| 6316952 | Flexible conductive structures and method | Syed Sajid Ahmad | 2001-11-13 |
| 6314641 | Interconnect for testing semiconductor components and method of fabrication | — | 2001-11-13 |
| 6313651 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Derek Gochnour | 2001-11-06 |
| 6313650 | Insert testing system | John R. C. Futrell, Steven M. McDonald | 2001-11-06 |
| 6313522 | Semiconductor structure having stacked semiconductor devices | Jerry M. Brooks | 2001-11-06 |
| 6310484 | Semiconductor test interconnect with variable flexure contacts | Alan G. Wood | 2001-10-30 |
| 6306727 | Advanced isolation process for large memory arrays | — | 2001-10-23 |
| 6307394 | Test carrier with variable force applying mechanism for testing semiconductor components | Warren M. Farnworth, James M. Wark, Derek Gochnour | 2001-10-23 |
| 6300786 | Wafer test method with probe card having on-board multiplex circuitry for expanding tester resources | C. Patrick Doherty, Jorge L. deVarona | 2001-10-09 |
| 6299456 | Interposer with contact structures for electrical testing | James M. Wark | 2001-10-09 |
| 6300163 | Stacked leads-over-chip multi-chip module | — | 2001-10-09 |
| 6299463 | Device and method for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications | — | 2001-10-09 |
| 6297660 | Test carrier with variable force applying mechanism for testing semiconductor components | Warren M. Farnworth, James M. Wark, Derek Gochnour | 2001-10-02 |
| 6295730 | Method and apparatus for forming metal contacts on a substrate | — | 2001-10-02 |
| 6295978 | Method for reducing damage to wafer cutting blades during wafer dicing | James M. Wark | 2001-10-02 |
| 6297547 | Mounting multiple semiconductor dies in a package | — | 2001-10-02 |
| 6297655 | Integrated circuit probing method | — | 2001-10-02 |
| 6294837 | Semiconductor interconnect having laser machined contacts | Warren M. Farnworth, Alan G. Wood | 2001-09-25 |
| 6291897 | Carriers including projected contact structures for engaging bumped semiconductor devices | James M. Wark | 2001-09-18 |
| 6287942 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 2001-09-11 |
| 6288433 | Field effect transistor having improved hot carrier immunity | Akram Ditali | 2001-09-11 |
| 6285201 | Method and apparatus for capacitively testing a semiconductor die | Warren M. Farnworth | 2001-09-04 |
| 6285203 | Test system having alignment member for aligning semiconductor components | Warren M. Farnworth, Michael E. Hess, David R. Hembree | 2001-09-04 |