Issued Patents All Time
Showing 551–575 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6188232 | Temporary package, system, and method for testing semiconductor dice and chip scale packages | Alan G. Wood, Warren M. Farnworth | 2001-02-13 |
| 6181144 | Semiconductor probe card having resistance measuring circuitry and method fabrication | David R. Hembree | 2001-01-30 |
| 6175147 | Device isolation for semiconductor devices | — | 2001-01-16 |
| 6175242 | Method for forming coaxial silicon interconnects | David R. Hembree, Alan G. Wood | 2001-01-16 |
| 6175149 | Mounting multiple semiconductor dies in a package | — | 2001-01-16 |
| 6175241 | Test carrier with decoupling capacitors for testing semiconductor components | David R. Hembree | 2001-01-16 |
| 6168837 | Chemical vapor depositions process for depositing titanium silicide films from an organometallic compound | — | 2001-01-02 |
| 6169021 | Method of making a metallized recess in a substrate | John R. C. Futrell, Steven M. McDonald | 2001-01-02 |
| 6165817 | Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections | Warren M. Farnworth | 2000-12-26 |
| 6165814 | Thin film capacitor coupons for memory modules and multi-chip modules | James M. Wark | 2000-12-26 |
| 6163490 | Semiconductor memory remapping | James M. Shaffer, Brent Keeth, Eugene H. Cloud | 2000-12-19 |
| 6159769 | Use of palladium in IC manufacturing | Warren M. Farnworth | 2000-12-12 |
| 6155247 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2000-12-05 |
| 6150717 | Direct die contact (DDC) semiconductor package | Alan G. Wood, Warren M. Farnworth, Ford B. Grigg | 2000-11-21 |
| 6144101 | Flip chip down-bond: method and apparatus | — | 2000-11-07 |
| 6140160 | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure | — | 2000-10-31 |
| 6140151 | Semiconductor wafer processing method | — | 2000-10-31 |
| 6133636 | Tantalum-aluminum-nitrogen material for semiconductor devices | Scott Meikle | 2000-10-17 |
| 6133065 | Multi-chip module employing carrier substrate with micromachined alignment structures and method of forming | — | 2000-10-17 |
| 6132570 | Method and apparatus for continuous processing of semiconductor wafers | David R. Hembree | 2000-10-17 |
| 6130148 | Interconnect for semiconductor components and method of fabrication | Warren M. Farnworth | 2000-10-10 |
| 6127736 | Microbump interconnect for semiconductor dice | — | 2000-10-03 |
| 6124634 | Micromachined chip scale package | David R. Hembree, Warren M. Farnworth | 2000-09-26 |
| 6124214 | Method and apparatus for ultrasonic wet etching of silicon | David R. Hembree | 2000-09-26 |
| 6122171 | Heat sink chip package and method of making | Larry D. Kinsman | 2000-09-19 |