Issued Patents All Time
Showing 701–725 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5753558 | Method of forming a capacitor | Charles L. Turner, Alan Laulusa | 1998-05-19 |
| 5742169 | Apparatus for testing interconnects for semiconductor dice | Warren M. Farnworth | 1998-04-21 |
| 5741547 | Method for depositing a film of titanium nitride | Daniel A. Koos | 1998-04-21 |
| 5739585 | Single piece package for semiconductor die | Alan G. Wood, Warren M. Farnworth | 1998-04-14 |
| 5738567 | Polishing pad for chemical-mechanical planarization of a semiconductor wafer | Adam W. Manzonie | 1998-04-14 |
| 5736456 | Method of forming conductive bumps on die for flip chip applications | — | 1998-04-07 |
| 5723907 | LOC SIMM | — | 1998-03-03 |
| 5719425 | Multiple implant lightly doped drain (MILDD) field effect transistor | Akram Ditali | 1998-02-17 |
| 5716218 | Process for manufacturing an interconnect for testing a semiconductor die | Warren M. Farnworth, Alan G. Wood | 1998-02-10 |
| 5691649 | Carrier having slide connectors for testing unpackaged semiconductor dice | Warren M. Farnworth, Mike Brooks | 1997-11-25 |
| 5686317 | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die | Warren M. Farnworth, Alan G. Wood | 1997-11-11 |
| 5682065 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 1997-10-28 |
| 5674785 | Method of producing a single piece package for semiconductor die | Alan G. Wood, Warren M. Farnworth | 1997-10-07 |
| 5661334 | Inter-metal dielectric structure which combines fluorine-doped glass and barrier layers | — | 1997-08-26 |
| 5658818 | Semiconductor processing method employing an angled sidewall | Charles L. Turner, Alan Laulusa | 1997-08-19 |
| 5609995 | Method for forming a thin uniform layer of resist for lithography | Paul D. Shirley, William T. Rericha | 1997-03-11 |
| 5607818 | Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition | Warren M. Farnworth, David R. Hembree | 1997-03-04 |
| 5592736 | Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads | Warren M. Farnworth, Alan G. Wood | 1997-01-14 |
| 5578934 | Method and apparatus for testing unpackaged semiconductor dice | Alan G. Wood, Warren M. Farnworth, David R. Hembree | 1996-11-26 |
| 5578526 | Method for forming a multi chip module (MCM) | Warren M. Farnworth, Alan G. Wood | 1996-11-26 |
| 5559444 | Method and apparatus for testing unpackaged semiconductor dice | Warren M. Farnworth, David R. Hembree | 1996-09-24 |
| 5495667 | Method for forming contact pins for semiconductor dice and interconnects | Warren M. Farnworth, Alan G. Wood | 1996-03-05 |
| 5483741 | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice | Warren M. Farnworth, Alan G. Wood | 1996-01-16 |
| 5478779 | Electrically conductive projections and semiconductor processing method of forming same | — | 1995-12-26 |
| 5444013 | Method of forming a capacitor | Charles L. Turner, Alan Laulusa | 1995-08-22 |