Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342278 | EMI shielding for flip chip package with exposed die backside | ChangOh Kim, Il Kwon Shim, InSang Yoon, KyoungHee Park | 2022-05-24 |
| 11211534 | Display device and method of fabricating the same | Subin Bae, Yu-Gwang Jeong, Sanggab Kim | 2021-12-28 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-10-12 |
| 11088082 | Semiconductor device with partial EMI shielding and method of making the same | ChangOh Kim, KyoungHee Park, KyoWang Koo | 2021-08-10 |
| 11087278 | Computerized systems and methods for managing inventory by grading returned products | Jong Woon Bae, Ha Dong Kang | 2021-08-10 |
| 11056094 | Method and apparatus for processing audio signal | Jinho Park, Guiwon SEO, Jonghwa Lee, Hyeongcheol Jeong | 2021-07-06 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-06-01 |
| 10985109 | Shielded semiconductor packages with open terminals and methods of making via two-step process | ChangOh Kim, KyoWang Koo, BongWoo Choi | 2021-04-20 |
| 10969889 | Electronic apparatus and method for manufacturing the same | Yu-Gwang Jeong, Sanggab Kim, Subin Bae | 2021-04-06 |
| 10910322 | Shielded semiconductor package with open terminal and methods of making | ChangOh Kim, KyoWang Koo, BongWoo Choi, Jiwon Lee | 2021-02-02 |
| 10804217 | EMI shielding for flip chip package with exposed die backside | ChangOh Kim, Il Kwon Shim, InSang Yoon, KyoungHee Park | 2020-10-13 |
| 10784210 | Semiconductor device with partial EMI shielding removal using laser ablation | ChangOh Kim, KyoWang Koo, BongWoo Choi, Jiwon Lee | 2020-09-22 |
| 10388611 | Semiconductor device and method of forming magnetic field shielding with ferromagnetic material | Seonhong Choi, ChangOh Kim | 2019-08-20 |
| 10353240 | Display apparatus and method of manufacturing the same | Seon-Il Kim, Ji Hun Kim, Yunjong Yeo, Sanggab Kim | 2019-07-16 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |
| 9780063 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | JoonYoung Choi, Youngjoon KIM | 2017-10-03 |
| 9373578 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | DaeSik Choi, OhHan Kim | 2016-06-21 |
| 9324659 | Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die | DaeSik Choi, HyungSang Park, DongSoo Moon | 2016-04-26 |
| 9324035 | Apparatus and method for predicting potential change of coronary artery calcification (CAC) level | Ji Hyun Lee, Hye Jin KAM, Ha-Young Kim, Sang Hyun Yoo, YoonHo Choi +5 more | 2016-04-26 |
| 9093392 | Integrated circuit packaging system with vertical interconnection and method of manufacture thereof | JoHyun Bae, DaeSik Choi, DongSoo Moon | 2015-07-28 |
| 9093278 | Method of manufacture of integrated circuit packaging system with plasma processing | JoonYoung Choi, Seong Won Park, KyungOe Kim, Hun Teak Lee | 2015-07-28 |
| 9082887 | Integrated circuit packaging system with posts and method of manufacture thereof | DaeSik Choi, Taewoo Lee, KyuWon Lee | 2015-07-14 |
| 8901734 | Semiconductor device and method of forming column interconnect structure to reduce wafer stress | TaeWoo Kang | 2014-12-02 |
| 8896133 | Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate | KiYoun Jang, YongHee Kang, Hyung Sang Park | 2014-11-25 |
| 8835301 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | JoonYoung Choi, Youngjoon KIM | 2014-09-16 |