Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8093707 | Leadframe packages having enhanced ground-bond reliability | Ein Sun Ng, Chue Siak Liu, Lee Han Meng@Eugene Lee, Yee Kim Lee | 2012-01-10 |
| 7846775 | Universal lead frame for micro-array packages | Nghia Thuc Tu, Sadanand R. Patil | 2010-12-07 |
| 7795126 | Electrical die contact structure and fabrication method | Ashok S. Prabhu, Sadanand R. Patil, Alexander H. Owens | 2010-09-14 |
| 7419855 | Apparatus and method for miniature semiconductor packages | Nghia Thuc Tu, Santhiran Nadarajah, Lim Peng Soon | 2008-09-02 |
| 7340181 | Electrical die contact structure and fabrication method | Ashok S. Prabhu, Sadanand R. Patil, Alexander H. Owens | 2008-03-04 |
| 7205095 | Apparatus and method for packaging image sensing semiconductor chips | Ashok S. Prabhu | 2007-04-17 |
| 7161232 | Apparatus and method for miniature semiconductor packages | Nghia Thuc Tu, Santhiran Nadarajah, Lim Peng Soon | 2007-01-09 |
| 7087986 | Solder pad configuration for use in a micro-array integrated circuit package | Jaime A. Bayan, Ashok S. Prabhu | 2006-08-08 |
| 6933212 | Apparatus and method for dicing semiconductor wafers | Nghia Thuc Tu, Sadanand R. Patil, Visvamohan Yegnashankaran | 2005-08-23 |
| 6873024 | Apparatus and method for wafer level packaging of optical imaging semiconductor devices | Ashok Prabhu | 2005-03-29 |
| 6723585 | Leadless package | Nghia Thuc Tu, Sadanand R. Patil | 2004-04-20 |
| 6551859 | Chip scale and land grid array semiconductor packages | Thanh Lequang, Wayne Lee, Glenn Narvaez, William Jeffery Schaefer | 2003-04-22 |
| 6396135 | Substrate for use in semiconductor packaging | Glenn Narvaez | 2002-05-28 |
| 6362530 | Manufacturing methods and construction for integrated circuit packages | Hem Takiar | 2002-03-26 |
| 6284566 | Chip scale package and method for manufacture thereof | Hem Takiar, Ranjan J. Mathew | 2001-09-04 |
| 6278618 | Substrate strips for use in integrated circuit packaging | Anindya Poddar, Ram Veeraraghavan, Thanh Lequang | 2001-08-21 |
| 6173490 | Method for forming a panel of packaged integrated circuits | Hem Takiar, Fred Drummond | 2001-01-16 |
| 6140708 | Chip scale package and method for manufacture thereof | Hem Takiar, Ranjan J. Mathew | 2000-10-31 |
| 6054338 | Low cost ball grid array device and method of manufacture thereof | Hem Takiar, Ranjan J. Mathew, Hee Jhin Kim | 2000-04-25 |
| 5796586 | Substrate board having an anti-adhesive solder mask | Poh Ling Lee, Anthony E. Panczak | 1998-08-18 |
| 5783866 | Low cost ball grid array device and method of manufacture thereof | Hem Takiar, Ranjan J. Mathew, Hee Jhin Kim | 1998-07-21 |
| 5686842 | Known good die test apparatus and method | — | 1997-11-11 |
| 5652185 | Maximized substrate design for grid array based assemblies | — | 1997-07-29 |
| 5620927 | Solder ball attachment machine for semiconductor packages | — | 1997-04-15 |
| 5620928 | Ultra thin ball grid array using a flex tape or printed wiring board substrate and method | Anthony E. Panczak, Jagdish G. Belani | 1997-04-15 |