| 12417926 |
Circuit interconnect structure |
Fee Li Lie, Hosadurga Shobha, Devika Sarkar Grant |
2025-09-16 |
| 12394660 |
Buried power rail after replacement metal gate |
Devika Sarkar Grant, Kisik Choi, Somnath Ghosh, Ruilong Xie |
2025-08-19 |
| 12334398 |
Multilayer dielectric stack for damascene top-via integration |
Devika Sarkar Grant, Fee Li Lie, Shravan Kumar Matham, Hosadurga Shobha, Gauri Karve |
2025-06-17 |
| 12317555 |
Gate-all-around nanosheet field effect transistor integrated with fin field effect transistor |
Julien Frougier, Ruqiang Bao, Andrew M. Greene, Jingyun Zhang, Nicolas Loubet +1 more |
2025-05-27 |
| 12268031 |
Backside power rails and power distribution network for density scaling |
Ruilong Xie, Kisik Choi, Somnath Ghosh, Albert M. Chu, Albert M. Young +6 more |
2025-04-01 |
| 12243771 |
Selective patterning of vias with hardmasks |
John C. Arnold, Ashim Dutta, Dominik Metzler, Timothy Mathew Philip |
2025-03-04 |
| 12243913 |
Self-aligned backside contact integration for transistors |
Nikhil Jain, Devika Sarkar Grant, Prabudhya Roy Chowdhury, Ruilong Xie, Kisik Choi |
2025-03-04 |
| 12206722 |
Correcting disruption of a network during a virtual meeting |
John S. Werner, Arkadiy O. Tsfasman, Dong Hyun Kim |
2025-01-21 |
| 12148699 |
High aspect ratio buried power rail metallization |
Devika Sarkar Grant, Fee Li Lie, Hosadurga Shobha, Thamarai S. Devarajan, Aakrati Jain |
2024-11-19 |
| 12080709 |
Dual inner spacer epitaxy in monolithic stacked FETs |
Julien Frougier, Nicolas Loubet, Ruilong Xie |
2024-09-03 |
| 11956296 |
Stream alterations under limited bandwidth conditions |
John S. Werner, Arkadiy O. Tsfasman |
2024-04-09 |
| 11908791 |
Partial subtractive supervia enabling hyper-scaling |
Nicholas Anthony Lanzillo |
2024-02-20 |
| 11894361 |
Co-integrated logic, electrostatic discharge, and well contact devices on a substrate |
Julien Frougier, Anthony I. Chou, Andrew M. Greene, Ruilong Xie, Veeraraghavan S. Basker +4 more |
2024-02-06 |
| 11380836 |
Topological qubit device |
Steven J. Holmes, Timothy Mathew Philip, Youngseok Kim, Devendra K. Sadana, Robert R. Robison |
2022-07-05 |
| 11276607 |
Selective patterning of vias with hardmasks |
John C. Arnold, Ashim Dutta, Dominik Metzler, Timothy Mathew Philip |
2022-03-15 |
| 11189527 |
Self-aligned top vias over metal lines formed by a damascene process |
Timothy Mathew Philip, Dominik Metzler, Ashim Dutta, John C. Arnold |
2021-11-30 |
| 11094590 |
Structurally stable self-aligned subtractive vias |
Dominik Metzler, Chanro Park, Timothy Mathew Philip |
2021-08-17 |
