| 11049819 |
Shielded package assemblies with integrated capacitor |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2021-06-29 |
| 10685919 |
Reduced-warpage laminate structure |
Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more |
2020-06-16 |
| 10553544 |
Shielded package assemblies with integrated capacitor |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2020-02-04 |
| 9935058 |
Shielded package assemblies with integrated capacitor |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2018-04-03 |
| 9613915 |
Reduced-warpage laminate structure |
Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more |
2017-04-04 |
| 9599664 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Luke D. LaCroix, Mark C. Lamorey, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr +1 more |
2017-03-21 |
| 9543255 |
Reduced-warpage laminate structure |
Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more |
2017-01-10 |
| 9531209 |
Shielded package assemblies with integrated capacitor |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2016-12-27 |
| 9252101 |
Packages for three-dimensional die stacks |
Mark C. H. Lamorey, Janak G. Patel, David B. Stone |
2016-02-02 |
| 9245854 |
Organic module EMI shielding structures and methods |
William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Mark C. Lamorey, Janak G. Patel +1 more |
2016-01-26 |
| 9209141 |
Shielded package assemblies with integrated capacitor |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-12-08 |
| 9190399 |
Thermally enhanced three-dimensional integrated circuit package |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-11-17 |
| 9185807 |
Integrated circuit structures having off-axis in-hole capacitor |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-11-10 |
| 9078373 |
Integrated circuit structures having off-axis in-hole capacitor and methods of forming |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-07-07 |
| 9057760 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Luke D. LaCroix, Mark C. Lamorey, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr +1 more |
2015-06-16 |
| 9059127 |
Packages for three-dimensional die stacks |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-06-16 |
| 9018040 |
Power distribution for 3D semiconductor package |
Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-04-28 |
| 8999846 |
Elongated via structures |
Luke D. LaCroix, Mark C. Lamorey, Janak G. Patel, David B. Stone |
2015-04-07 |
| 8952503 |
Organic module EMI shielding structures and methods |
William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Mark C. Lamorey, Janak G. Patel +1 more |
2015-02-10 |
| 8759977 |
Elongated via structures |
Luke D. LaCroix, Mark C. Lamorey, Janak G. Patel, David B. Stone |
2014-06-24 |
| 8653662 |
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits |
Luke D. LaCroix, Mark C. Lamorey, Janak G. Patel, David B. Stone |
2014-02-18 |
| 8586982 |
Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability |
Luke D. LaCroix, Janak G. Patel, David B. Stone |
2013-11-19 |
| 8444043 |
Uniform solder reflow fixture |
William E. Bernier, Marcus E. Interrante, Rajneesh Kumar, Chenzhou Lian, Janak G. Patel |
2013-05-21 |
| 4846929 |
Wet etching of thermally or chemically cured polyimide |
Steven L. Bard, Claudius Feger, John J. Glenning, Gareth G. Hougham, Steven E. Molis +3 more |
1989-07-11 |
| 4615763 |
Roughening surface of a substrate |
Jeffrey D. Gelorme, William H. Lawrence |
1986-10-07 |
