LC

Liu Chen

Infineon Technologies Ag: 11 patents #789 of 7,486Top 15%
MO Molex: 2 patents #661 of 1,726Top 40%
Overall (All Time): #367,485 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11903132 Power electronic assembly having a laminate inlay and method of producing the power electronic assembly Petteri Palm, Martin Benisek, Frank Daeche, Josef Maerz 2024-02-13
11632860 Power electronic assembly and method of producing thereof Petteri Palm, Martin Benisek, Frank Daeche, Josef Maerz 2023-04-18
11239127 Topside-cooled semiconductor package with molded standoff Edward Myers, Chee Chiew Chong, Wee Aun Jason Lim, Wee Boon Tay 2022-02-01
11127853 Power transistor device including first and second transistor cells having different on-resistances for improved thermal stability Cristian Mihai Boianceanu, Sebastian Sosin, Andrew Christopher Graeme Wood 2021-09-21
10727151 Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package Teck Sim Lee, Jia Yi Wong, Wei Han Koo, Thomas Stoeck, Gilles Delarozee 2020-07-28
10290567 Transistor package with three-terminal clip Rainald Sander, Teck Sim Lee 2019-05-14
10168391 Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto Giuliano Angelo Babulano, Jens Oetjen, Toni Salminen, Stefan Mieslinger, Markus Dinkel +4 more 2019-01-01
9681558 Module with integrated power electronic circuitry and logic circuitry Markus Dinkel, Toni Salminen 2017-06-13
9564578 Semiconductor package with integrated magnetic field sensor Thorsten Meyer, Martin Gruber, Rainer Markus Schaller, Franz Jost, Stefan Mieslinger +4 more 2017-02-07
9564423 Power package with integrated magnetic field sensor Toni Salminen, Stefan Mieslinger, Giuliano Angelo Babulano, Jens Oetjen, Markus Dinkel +1 more 2017-02-07
9385059 Overmolded substrate-chip arrangement with heat sink Peter Ossimitz, Juergen Schaefer, Markus Dinkel, Stefan Macheiner 2016-07-05
5747735 Grounding clip for IC cards Wei-Sun Chang 1998-05-05
5421737 Universal ejector mechanism for an IC card connector apparatus Yu-Wen Chen, Nai-Kei Wong 1995-06-06