Issued Patents All Time
Showing 25 most recent of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9359673 | Apparatus and method for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi | 2016-06-07 |
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2016-03-15 |
| 9117860 | Controlled ambient system for interface engineering | Yezdi Dordi, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks, William Thie +7 more | 2015-08-25 |
| 8926789 | Apparatus for the removal of a fluorinated polymer from a substrate | Hyungsuk Alexander Yoon, Andras Kuthi, Andrew D. Bailey, III | 2015-01-06 |
| 8916232 | Method for barrier interface preparation of copper interconnect | Hyungsuk Alexander Yoon, Yezdi Dordi, Fritz Redeker | 2014-12-23 |
| 8844461 | Fluid handling system for wafer electroless plating and associated methods | William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2014-09-30 |
| 8771804 | Processes and systems for engineering a copper surface for selective metal deposition | Yezdi Dordi, Tiruchirapalli Arunagiri, Fritz Redeker, William Thie, Arthur M. Howald | 2014-07-08 |
| 8747960 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide | Yezdi Dordi, Tiruchirapalli Arunagiri, Johan VERTOMMEN, Fritz Redeker, William Thie +1 more | 2014-06-10 |
| 8691027 | Method for removing material from semiconductor wafer and apparatus for performing the same | Mikhail Korolik, Michael Ravkin, John M. de Larios, Fritz Redeker | 2014-04-08 |
| 8673769 | Methods and apparatuses for three dimensional integrated circuits | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2014-03-18 |
| 8622020 | Simultaneous electroless plating of two substrates | William Thie, Yezdi Dordi, Fritz Redeker | 2014-01-07 |
| 8623456 | Methods for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi | 2014-01-07 |
| 8519461 | Device with post-contact back end of line through-hole via integration | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2013-08-27 |
| 8490573 | Method and apparatus for material deposition | Yezdi Dordi, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2013-07-23 |
| 8485120 | Method and apparatus for wafer electroless plating | William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2013-07-16 |
| 8419917 | Electroplating head and method for operating the same | Yezdi Dordi, Bob Maraschin, Fred C. Redeker | 2013-04-16 |
| 8403727 | Pre-planarization system and method | Fred C. Redeker, Yezdi Dordi, Sabir A. Majumder, Simon McClatchie | 2013-03-26 |
| 8330072 | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology | Fred C. Redeker | 2012-12-11 |
| 8323460 | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2012-12-04 |
| 8323420 | Method for removing material from semiconductor wafer and apparatus for performing the same | Mikhail Korolik, Michael Ravkin, John deLarios, Fritz Redeker | 2012-12-04 |
| 8314027 | Wafer electroless plating system and associated methods | William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2012-11-20 |
| 8287647 | Apparatus and method for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi | 2012-10-16 |
| 8241701 | Processes and systems for engineering a barrier surface for copper deposition | Yezdi Dordi, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon, Fritz Redeker, William Thie +1 more | 2012-08-14 |
| 8187968 | Methods of post-contact back end of line through-hole via integration | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2012-05-29 |
| 8133812 | Methods and systems for barrier layer surface passivation | Yezdi Dordi, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Alex Yoon | 2012-03-13 |