Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7737021 | Resist trim process to define small openings in dielectric layers | Srikanteswara Dakshina-Murthy, Paul R. Besser, Jonathan B. Smith, Eric M. Apelgren, Christian Zistl +2 more | 2010-06-15 |
| 7381660 | Dielectric barrier layer for a copper metallization layer having a varying silicon concentration along its thickness | Larry Zhao, Hartmut Ruelke | 2008-06-03 |
| 7369905 | Method and apparatus for pressure and plasma control during transitions used to create graded interfaces by multi-step PECVD deposition | — | 2008-05-06 |
| 6989601 | Copper damascene with low-k capping layer and improved electromigration reliability | Minh Van Ngo, Hartmut Ruelke | 2006-01-24 |
| 6927113 | Semiconductor component and method of manufacture | Kashmir Sahota, Richard J. Huang, James J. Xie | 2005-08-09 |
| 6797652 | Copper damascene with low-k capping layer and improved electromigration reliability | Minh Van Ngo, Hartmut Ruelke | 2004-09-28 |
| 6642619 | System and method for adhesion improvement at an interface between fluorine doped silicon oxide and tantalum | Minh Van Ngo, Dawn Hopper | 2003-11-04 |
| 6610594 | Locally increasing sidewall density by ion implantation | Eric M. Apelgren, Christian Zistl, Paul R. Besser, Fred Cheung | 2003-08-26 |
| 6600333 | Method and test structure for characterizing sidewall damage in a semiconductor device | Nicholas J. Kepler, Larry Zhao | 2003-07-29 |
| 6514844 | Sidewall treatment for low dielectric constant (low K) materials by ion implantation | Eric M. Apelgren, Christian Zistl, Paul R. Besser, Srikantewara Dakshina-Murthy, Jonathan B. Smith +2 more | 2003-02-04 |
| 6500755 | Resist trim process to define small openings in dielectric layers | Srikanteswara Dakshina-Murthy, Paul R. Besser, Jonathan B. Smith, Eric M. Apelgren, Christian Zistl +2 more | 2002-12-31 |
| 6498112 | Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films | Ting Tsui | 2002-12-24 |
| 6436808 | NH3/N2-plasma treatment to prevent organic ILD degradation | Minh Van Ngo, Dawn Hopper | 2002-08-20 |
| 6420193 | Repair of film having an SI-O backbone | — | 2002-07-16 |
| 6406993 | Method of defining small openings in dielectric layers | Srikanteswara Dakshina-Murthy, Paul R. Besser, Jonathan B. Smith, Eric M. Apelgren, Christian Zistl +2 more | 2002-06-18 |
| 6294472 | Dual slurry particle sizes for reducing microscratching of wafers | Jonathan B. Smith, Paul R. Besser | 2001-09-25 |