Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11753343 | Method for manufacturing synthetic gemstone | Chul-Hong Choi, Dong Wook Shin, Jung Min Kim | 2023-09-12 |
| 11466239 | Biological material manufacturing device and driving method thereof | Chul-Hong Choi, Dong Wook Shin, Jung Min Kim | 2022-10-11 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-10-12 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-06-01 |
| 10844512 | Method for manufacturing synthetic gemstone | Chul-Hong Choi, Dong Wook Shin, Jung Min Kim | 2020-11-24 |
| 10083903 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | DeokKyung Yang, Sungmin Song | 2018-09-25 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |
| 9905491 | Interposer substrate designs for semiconductor packages | DeokKyung Yang, SeongHun Mun | 2018-02-27 |
| 9748203 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DeokKyung Yang, SeongHun Mun, Kyunghwan KIM | 2017-08-29 |
| 9385066 | Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof | DeokKyung Yang, Sungmin Song | 2016-07-05 |
| 9349666 | Integrated circuit packaging system with package stacking | JoHyun Bae, DaeSik Choi | 2016-05-24 |
| 9202715 | Integrated circuit packaging system with connection structure and method of manufacture thereof | YoungChul Kim, KyungHoon Lee, Seong Won Park, Ki Youn Jang, Jaehyun Lee +2 more | 2015-12-01 |
| 9142530 | Coreless integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Sung-Soo Kim, Asri Yusof | 2015-09-22 |
| 8765525 | Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer | DeokKyung Yang, Sungmin Song | 2014-07-01 |
| 8698297 | Integrated circuit packaging system with stack device | JoHyun Bae, DaeSik Choi | 2014-04-15 |
| 8674516 | Integrated circuit packaging system with vertical interconnects and method of manufacture thereof | Byung Joon Han, JoHyun Bae | 2014-03-18 |
| 8633100 | Method of manufacturing integrated circuit packaging system with support structure | DeokKyung Yang, Sangjin Lee | 2014-01-21 |
| 8558366 | Integrated circuit packaging system with interposer interconnections and method of manufacture thereof | A Leam Choi, Kenny Lee, HanGil Shin | 2013-10-15 |
| 8497575 | Semiconductor packaging system with an aligned interconnect and method of manufacture thereof | JoHyun Bae, DeokKyung Yang | 2013-07-30 |
| 8409917 | Integrated circuit packaging system with an interposer substrate and method of manufacture thereof | HeeJo Chi, HanGil Shin | 2013-04-02 |
| 8367465 | Integrated circuit package on package system | DongSam Park, Choong Bin Yim | 2013-02-05 |
| 8299595 | Integrated circuit package system with package stacking and method of manufacture thereof | Seongmin Lee, Sangjin Lee | 2012-10-30 |
| 8247894 | Integrated circuit package system with step mold recess | HanGil Shin, Jae Han Chung, DeokKyung Yang | 2012-08-21 |
| 8129832 | Mountable integrated circuit package system with substrate having a conductor-free recess | Flynn Carson, Seongmin Lee, JoHyun Bae | 2012-03-06 |
| 8130512 | Integrated circuit package system and method of package stacking | Seongmin Lee, Sungmin Song | 2012-03-06 |