Issued Patents All Time
Showing 25 most recent of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10612084 | Reduction of entropic barrier of polyelectrolyte molecules in a nanopore device with agarose gel | Gustavo A. Stolovitzky, Chao Wang, Deqiang Wang | 2020-04-07 |
| 10612085 | Reduction of entropic barrier of polyelectrolyte molecules in a nanopore device with agarose gel | Gustavo A. Stolovitzky, Chao Wang, Deqiang Wang | 2020-04-07 |
| 10592503 | Empathy injection for question-answering systems | James R. Kozloski, James W. Murdock, IV, Clifford A. Pickover | 2020-03-17 |
| 9471623 | Empathy injection for question-answering systems | James R. Kozloski, James W. Murdock, IV, Clifford A. Pickover | 2016-10-18 |
| 9298766 | Empathy injection for question-answering systems | James R. Kozloski, James W. Murdock, IV, Clifford A. Pickover | 2016-03-29 |
| 9250206 | Controlled translocation of macromolecules employing a funnel nanopore structure and a gel | — | 2016-02-02 |
| 9250207 | Controlled translocation of macromolecules employing a funnel nanopore structure and a gel | — | 2016-02-02 |
| 8878259 | Super lattice/quantum well nanowires | Harold J. Hovel, Qiang Huang, Xiaoyan Shao, James Vichiconti | 2014-11-04 |
| 8764968 | DNA sequencing using multiple metal layer structure with organic coatings forming transient bonding to DNA bases | Ali Afzali-Ardakani, Stefan Harrer, Binquan Luan, Glenn J. Martyna, Hongbo Peng +3 more | 2014-07-01 |
| 8691067 | Charged entities as locomotive to control motion of polymers through a nanochannel | Stefan Harrer, Binquan Luan, Glenn J. Martyna, Hongbo Peng, Stanislav Polonsky +3 more | 2014-04-08 |
| 8641879 | Charged entities as locomotive to control motion of polymers through a nanochannel | Stefan Harrer, Binquan Luan, Glenn J. Martyna, Hongbo Peng, Stanislav Polonsky +3 more | 2014-02-04 |
| 8613908 | System and method for authenticating pharmaceuticals using internally located hydroscopic gels with indicia | — | 2013-12-24 |
| 8273591 | Super lattice/quantum well nanowires | Harold J. Hovel, Qiang Huang, Xiaoyan Shao, James Vichiconti | 2012-09-25 |
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer | Yu-Ting Cheng, Sherif A. Goma, John Harold Magerlein, Sampath Purushothaman, Carlos J. Sambucetti | 2011-02-01 |
| 7546670 | Method for producing thermally matched probe assembly | Timothy J. Dalton, Samuel McKnight, Simon Karecki | 2009-06-16 |
| 7538565 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 2009-05-26 |
| 7355271 | Flexible assembly of stacked chips | Richard P. Volant, Kevin S. Petrarca | 2008-04-08 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same | Daniel C. Edelstein, Paul S. Andry, Leena Paivikki Buchwalter, Jon A. Casey, Sherif A. Goma +9 more | 2007-10-02 |
| 7276919 | High density integral test probe | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 2007-10-02 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder | Robert A. Groves, Peter A. Gruber, Kevin S. Petrarca, Richard P. Volant | 2007-09-25 |
| 7252514 | High density space transformer and method of fabricating same | Samuel McKnight | 2007-08-07 |
| 7115996 | Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped | Daniel C. Edelstein, Sung Kwon Kang, Maurice McGlashan-Powell, Eugene J. O'Sullivan | 2006-10-03 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-09 |
| 6924185 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-02 |
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Carlos J. Sambucetti, Richard P. Volant | 2004-11-16 |