| 6720264 |
Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
Kashmir Sahota, Johannes Groschopf, Gerd Marxsen, Steven C. Avanzino |
2004-04-13 |
| 6596637 |
Chemically preventing Cu dendrite formation and growth by immersion |
Steven C. Avanzino, Kai Yang |
2003-07-22 |
| 6528409 |
Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
Sergey Lopatin, Fei Wang, Steven C. Avanzino |
2003-03-04 |
| 6503418 |
Ta barrier slurry containing an organic additive |
Kashmir Sahota, Steven C. Avanzino |
2003-01-07 |
| 6433402 |
Selective copper alloy deposition |
Christy Mei-Chu Woo, Pin-Chin Connie Wang, Amit P. Marathe |
2002-08-13 |
| 6319833 |
Chemically preventing copper dendrite formation and growth by spraying |
Steven C. Avanzino, Kai Yang |
2001-11-20 |
| 6218290 |
Copper dendrite prevention by chemical removal of dielectric |
Steven C. Avanzino, Kai Yang |
2001-04-17 |
| 6207569 |
Prevention of Cu dendrite formation and growth |
Steven C. Avanzino, Kai Yang |
2001-03-27 |
| 6197690 |
Chemically preventing Cu dendrite formation and growth by double sided scrubbing |
Steven C. Avanzino, Kai Yang |
2001-03-06 |
| 6177349 |
Preventing Cu dendrite formation and growth |
Steven C. Avanzino, Kai Yang |
2001-01-23 |
| 6169034 |
Chemically removable Cu CMP slurry abrasive |
Steven C. Avanzino, Darrell M. Erb, Kai Yang |
2001-01-02 |
| 6162727 |
Chemical treatment for preventing copper dendrite formation and growth |
Steven C. Avanzino, Kai Yang |
2000-12-19 |
| 6153933 |
Elimination of residual materials in a multiple-layer interconnect structure |
Darin A. Chan, Steven C. Avanzino, Subramanian Venkatkrishnan, Minh Van Ngo, Christy Mei-Chu Woo de la Girond'arc |
2000-11-28 |
| 6140239 |
Chemically removable Cu CMP slurry abrasive |
Steven C. Avanzino, Darrell M. Erb, Kai Yang |
2000-10-31 |
| 6074949 |
Method of preventing copper dendrite formation and growth |
Steven C. Avanzino, Kai Yang |
2000-06-13 |
| 5936307 |
Surface modification method for film stress reduction |
Subhash Gupta, Paul R. Besser, Bhanwar Singh |
1999-08-10 |
| 5916855 |
Chemical-mechanical polishing slurry formulation and method for tungsten and titanium thin films |
Steven C. Avanzino, Christy Mei-Chu Woo, Peter A. Burke |
1999-06-29 |
| 5702563 |
Reduced chemical-mechanical polishing particulate contamination |
Isidore Salugsugan |
1997-12-30 |
| 5662769 |
Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning |
Steven C. Avanzino |
1997-09-02 |