Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300559 | Semiconductor packages and methods for manufacturing thereof | Si Hao Vincent Yeo, Ying Dieh Cheong, Chau Fatt Chiang, Cher Hau Danny Koh, Wern Ken Daryl Wee +7 more | 2025-05-13 |
| 12278171 | Chip package and method of forming a chip package | Wern Ken Daryl Wee, Hoe Jian Chong, Chin Kee Leow | 2025-04-15 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Wern Ken Daryl Wee, Chee Hong Lee, Swee Kah Lee +2 more | 2024-12-24 |
| 11469161 | Lead frame-based semiconductor package | Thorsten Scharf, Wolfgang Hetzel, Swee Kah Lee, Stefan Macheiner | 2022-10-11 |
| 11274984 | Pressure sensor having a lidless/laminate structure | Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee +4 more | 2022-03-15 |
| 11217511 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Sock Chien Tey, Hoe Jian Chong, Cher Hau Danny Koh, Kim Guan Tan, Mei Yong Wang | 2022-01-04 |
| 11081455 | Semiconductor device with bond pad extensions formed on molded appendage | Wei Han Koo, Thorsten Meyer, Klaus Schiess, Guan Choon Matthew Nelson Tee | 2021-08-03 |
| 10396018 | Multi-phase half bridge driver package and methods of manufacture | Chau Fatt Chiang, Wei Han Koo, Andreas Kucher, Theng Chao Long | 2019-08-27 |