Issued Patents All Time
Showing 25 most recent of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414480 | MRAM bottom electrode contact with taper profile | Saumya Sharma, Tianji Zhou, Chih-Chao Yang | 2025-09-09 |
| 12414312 | Back-end-of-line thin film resistor | Baozhen Li, Chih-Chao Yang, Huimei Zhou | 2025-09-09 |
| 12389803 | Magnetoresistive random-access memory (MRAM) with preserved underlying dielectric layer | Shyng-Tsong Chen, Terry A. Spooner, Chih-Chao Yang | 2025-08-12 |
| 12363913 | Fabrication of embedded memory devices utilizing a self assembled monolayer | Ekmini Anuja De Silva, Chih-Chao Yang | 2025-07-15 |
| 12341066 | Advanced metal interconnect | Chih-Chao Yang, Lawrence A. Clevenger, Ruilong Xie | 2025-06-24 |
| 12327770 | Probe pad with built-in interconnect structure | Ruturaj Nandkumar Pujari, Saumya Sharma, Chih-Chao Yang | 2025-06-10 |
| 12324358 | Tall bottom electrode structure in embedded magnetoresistive random-access memory | Lili Cheng, Chih-Chao Yang | 2025-06-03 |
| 12277960 | Modified top electrode contact for MRAM embedding in advanced logic nodes | Dominik Metzler, Oscar van der Straten, Theodorus E. Standaert | 2025-04-15 |
| 12272545 | Embedded metal contamination removal from BEOL wafers | Devika Sil, Yann Mignot, John C. Arnold, Daniel C. Edelstein, Kedari Matam +1 more | 2025-04-08 |
| 12243771 | Selective patterning of vias with hardmasks | John C. Arnold, Dominik Metzler, Timothy Mathew Philip, Sagarika Mukesh | 2025-03-04 |
| 12219881 | Dual layer top contact for magnetic tunnel junction stack | Chih-Chao Yang | 2025-02-04 |
| 12207561 | MRAM device with wrap-around top electrode | Shravana Kumar Katakam, Chih-Chao Yang | 2025-01-21 |
| 12183630 | Additive interconnect formation | Ekmini Anuja De Silva, Chih-Chao Yang, Jennifer Church | 2024-12-31 |
| 12144263 | Stepped contact within memory region | Lili Cheng, Chih-Chao Yang | 2024-11-12 |
| 12133473 | Contact structure formation for memory devices | Chih-Chao Yang | 2024-10-29 |
| 12125790 | Airgap isolation for back-end-of-the-line semiconductor interconnect structure with top via | Ekmini Anuja De Silva, Praveen Joseph, Jennifer Church | 2024-10-22 |
| 12120963 | Contact structure formation for memory devices | Lili Cheng, Chih-Chao Yang | 2024-10-15 |
| 12058942 | MRAM cell embedded in a metal layer | Chih-Chao Yang | 2024-08-06 |
| 11955152 | Dielectric fill for tight pitch MRAM pillar array | Chih-Chao Yang, Theodorus E. Standaert, Daniel C. Edelstein | 2024-04-09 |
| 11937435 | High density two-tier MRAM structure | Chih-Chao Yang | 2024-03-19 |
| 11923311 | Forming self-aligned multi-metal interconnects | Ekmini Anuja De Silva | 2024-03-05 |
| 11910722 | Subtractive top via as a bottom electrode contact for an embedded memory | Chih-Chao Yang | 2024-02-20 |
| 11876047 | Decoupled interconnect structures | Saumya Sharma, Tianji Zhou, Chih-Chao Yang | 2024-01-16 |
| 11856878 | High-density resistive random-access memory array with self-aligned bottom electrode contact | Dexin Kong, Ekmini Anuja De Silva, Daniel Schmidt | 2023-12-26 |
| 11849647 | Nonmetallic liner around a magnetic tunnel junction | Tao Li, Yann Mignot, Tsung-Sheng Kang, Wenyu Xu | 2023-12-19 |