Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414480 | MRAM bottom electrode contact with taper profile | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2025-09-09 |
| 12327770 | Probe pad with built-in interconnect structure | Ashim Dutta, Ruturaj Nandkumar Pujari, Chih-Chao Yang | 2025-06-10 |
| 11876047 | Decoupled interconnect structures | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2024-01-16 |
| 11621294 | Embedding MRAM device in advanced interconnects | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2023-04-04 |
| 11361987 | Forming decoupled interconnects | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2022-06-14 |
| 11251368 | Interconnect structures with selective capping layer | Tianji Zhou, Ashim Dutta, Chih-Chao Yang | 2022-02-15 |
| 11244907 | Metal surface preparation for increased alignment contrast | Tianji Zhou, Dominik Metzler, Chih-Chao Yang, Theodorus E. Standaert | 2022-02-08 |
| 11239160 | E-fuse with dielectric zipping | Tianji Zhou, Ashim Dutta, Chih-Chao Yang | 2022-02-01 |
| 11227997 | Planar resistive random-access memory (RRAM) device with a shared top electrode | Ashim Dutta, Tianji Zhou, Chih-Chao Yang | 2022-01-18 |
| 11177213 | Embedded small via anti-fuse device | Chih-Chao Yang, Baozhen Li, Tianji Zhou, Ashim Dutta | 2021-11-16 |