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Grounded lid for micro-electronic assemblies |
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Additives for grain fragmentation in Pb-free Sn-based solder |
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| 8786059 |
Passivation layer surface topography modifications for improved integrity in packaged assemblies |
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Grounded lid for micro-electronic assemblies |
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| 8493746 |
Additives for grain fragmentation in Pb-free Sn-based solder |
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2013-07-23 |
| 8236615 |
Passivation layer surface topography modifications for improved integrity in packaged assemblies |
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| 7512518 |
Method for measuring thin layers in solid state devices |
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2009-03-31 |
