Issued Patents All Time
Showing 101–125 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700002 | Ultra high performance interposer | Zhuowen Sun | 2020-06-30 |
| 10672654 | Microelectronic assembly from processed substrate | Laura Wills Mirkarimi | 2020-06-02 |
| 10629577 | Direct-bonded LED arrays and applications | Min Tao, Liang Wang, Rajesh Katkar | 2020-04-21 |
| 10629567 | Multiple plated via arrays of different wire heights on same substrate | Rajesh Katkar | 2020-04-21 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Liang Wang | 2020-03-10 |
| 10586759 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Laura Wills Mirkarimi | 2020-03-10 |
| 10535626 | Structures and methods for low temperature bonding using nanoparticles | — | 2020-01-14 |
| 10535564 | Structures and methods for reliable packages | Guilian Gao, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2020-01-14 |
| 10531574 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Hong Shen | 2020-01-07 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10515925 | Die processing | — | 2019-12-24 |
| 10515838 | Method and apparatus for stacking devices in an integrated circuit assembly | — | 2019-12-24 |
| 10515913 | Multi-metal contact structure | Rajesh Katkar | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10475726 | Low CTE component with wire bond interconnects | Rajesh Katkar | 2019-11-12 |
| 10475733 | Method and structures for heat dissipating interposers | Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2019-11-12 |
| 10446532 | Systems and methods for efficient transfer of semiconductor elements | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2019-10-15 |
| 10446441 | Flat metal features for microelectronics applications | — | 2019-10-15 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2019-10-08 |
| 10418338 | Interconnections for a substrate associated with a backside reveal | — | 2019-09-17 |
| 10410977 | High performance compliant substrate | Rajesh Katkar | 2019-09-10 |
| 10396114 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Michael Newman, Terrence Caskey | 2019-08-27 |
| 10333014 | Method and substrates for making photovoltaic cells | Emeka Nchekwube | 2019-06-25 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Gabriel Z. Guevara, Xuan Li, Guilian Gao, Liang Wang | 2019-06-25 |
| 10332833 | Ultra high performance interposer | Zhuowen Sun | 2019-06-25 |