Issued Patents All Time
Showing 151–175 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10015881 | Cavities containing multi-wiring structures and devices | Craig Mitchell, Belgacem Haba, Ilyas Mohammed | 2018-07-03 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Hong Shen, Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Laura Wills Mirkarimi | 2018-07-03 |
| 10008534 | Microelectronic package with horizontal and vertical interconnections | Rajesh Katkar | 2018-06-26 |
| 9991231 | Stacked die integrated circuit | Charles G. Woychik, Ron Zhang, Daniel Buckminster, Guilian Gao | 2018-06-05 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Charles G. Woychik, Liang Wang | 2018-04-24 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905713 | Method and substrates for material application | Emeka Nchekwube | 2018-02-27 |
| 9905537 | Compact semiconductor package and related methods | — | 2018-02-27 |
| 9893030 | Reliable device assembly | Belgacem Haba, Charles G. Woychik, Michael Newman, Terrence Caskey | 2018-02-13 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Hong Shen | 2018-02-06 |
| 9877487 | Compositions for effective fly population suppression | Emeka Nchekwube | 2018-01-30 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Ashok S. Prabhu, Rajesh Katkar, Liang Wang | 2018-01-16 |
| 9865675 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Rajesh Katkar, Hong Shen | 2018-01-09 |
| 9865548 | Polymer member based interconnect | Rajesh Katkar, Charles G. Woychik, Guilian Gao, Arkalgud R. Sitaram | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Guilian Gao, Bongsub Lee, Scott McGrath, Hong Shen, Charles G. Woychik +2 more | 2018-01-02 |
| 9853000 | Warpage reduction in structures with electrical circuitry | — | 2017-12-26 |
| 9853004 | Interconnections for a substrate associated with a backside reveal | — | 2017-12-26 |
| 9852969 | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects | Rajesh Katkar | 2017-12-26 |
| 9842819 | Tall and fine pitch interconnects | Rajesh Katkar | 2017-12-12 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Charles G. Woychik, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9818713 | Structures and methods for low temperature bonding using nanoparticles | — | 2017-11-14 |
| 9812360 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2017-11-07 |
| 9799626 | Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers | Rajesh Katkar | 2017-10-24 |
| 9793198 | Conductive connections, structures with such connections, and methods of manufacture | Rajesh Katkar | 2017-10-17 |
| 9780042 | Tunable composite interposer | Charles G. Woychik, Hiroaki Sato | 2017-10-03 |