Issued Patents All Time
Showing 126–150 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Sangil Lee, Liang Wang, Guilian Gao | 2019-06-18 |
| 10297582 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10290613 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2019-05-14 |
| 10283484 | Low cost substrates | Arkalgud R. Sitaram | 2019-05-07 |
| 10283449 | Low stress vias | Ilyas Mohammed, Belgacem Haba | 2019-05-07 |
| 10269756 | Die processing | — | 2019-04-23 |
| 10211160 | Microelectronic assembly with redistribution structure formed on carrier | Belgacem Haba, Wael Zohni | 2019-02-19 |
| 10204893 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2019-02-12 |
| 10199275 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2019-02-05 |
| 10181411 | Method for fabricating a carrier-less silicon interposer | Michael Newman, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2019-01-15 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Sangil Lee, Liang Wang, Guilian Gao | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |
| 10163757 | Method and structures for via substrate repair and assembly | — | 2018-12-25 |
| 10163675 | Method and apparatus for stacking devices in an integrated circuit assembly | — | 2018-12-25 |
| 10159148 | Porous alumina templates for electronic packages | Rajesh Katkar, Belgacem Haba, Ilyas Mohammed | 2018-12-18 |
| 10147548 | Capacitors using porous alumina structures | Rajesh Katkar | 2018-12-04 |
| 10103121 | Tall and fine pitch interconnects | Rajesh Katkar | 2018-10-16 |
| 10103094 | Method and structures for heat dissipating interposers | Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2018-10-16 |
| 10103093 | Via structure for signal equalization | Zhuowen Sun, Yong-Syuan Chen | 2018-10-16 |
| 10090231 | Conductive connections, structures with such connections, and methods of manufacture | Rajesh Katkar | 2018-10-02 |
| 10049998 | Conductive connections, structures with such connections, and methods of manufacture | Rajesh Katkar | 2018-08-14 |
| 10037940 | Reliable packaging and interconnect structures | Belgacem Haba, Craig Mitchell | 2018-07-31 |
| 10032715 | Ultra high performance interposer | Zhuowen Sun | 2018-07-24 |
| 10032647 | Low CTE component with wire bond interconnects | Rajesh Katkar | 2018-07-24 |
| 10026717 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2018-07-17 |