Issued Patents All Time
Showing 76–100 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088099 | Multi-metal contact structure in microelectronic component | Rajesh Katkar | 2021-08-10 |
| 11056390 | Structures and methods for reliable packages | Guilian Gao, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2021-07-06 |
| 11037919 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2021-06-15 |
| 11031285 | Diffusion barrier collar for interconnects | Rajesh Katkar | 2021-06-08 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed | 2021-05-18 |
| 11004757 | Bonded structures | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr. | 2021-05-11 |
| 10985133 | Die processing | — | 2021-04-20 |
| 10957661 | Interconnections for a substrate associated with a backside reveal | — | 2021-03-23 |
| 10910344 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2021-02-02 |
| 10896902 | Systems and methods for efficient transfer of semiconductor elements | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2021-01-19 |
| 10892246 | Structures and methods for low temperature bonding using nanoparticles | — | 2021-01-12 |
| 10886250 | Structures and methods for low temperature bonding using nanoparticles | — | 2021-01-05 |
| 10879212 | Processed stacked dies | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2020-12-29 |
| 10879226 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2020-12-29 |
| 10849240 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Hong Shen | 2020-11-24 |
| 10840205 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Jeremy Alfred Theil | 2020-11-17 |
| 10840135 | Flat metal features for microelectronics applications | — | 2020-11-17 |
| 10818629 | Tall and fine pitch interconnects | Rajesh Katkar | 2020-10-27 |
| 10813214 | Cavities containing multi-wiring structures and devices | Craig Mitchell, Belgacem Haba, Ilyas Mohammed | 2020-10-20 |
| 10804151 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2020-10-13 |
| 10796936 | Die tray with channels | — | 2020-10-06 |
| 10790262 | Low temperature bonded structures | Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2020-09-29 |
| 10727219 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2020-07-28 |
| 10714449 | Die processing | — | 2020-07-14 |
| 10707087 | Processing stacked substrates | Guilian Gao | 2020-07-07 |