Issued Patents All Time
Showing 51–75 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749645 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Belgacem Haba, Laura Wills Mirkarimi +1 more | 2023-09-05 |
| 11742315 | Die processing | — | 2023-08-29 |
| 11742314 | Reliable hybrid bonded apparatus | Pawel Mrozek | 2023-08-29 |
| 11735523 | Laterally unconfined structure | — | 2023-08-22 |
| 11715730 | Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements | Min Tao, Liang Wang, Rajesh Katkar | 2023-08-01 |
| 11710718 | Structures and methods for low temperature bonding using nanoparticles | — | 2023-07-25 |
| 11694925 | Diffusion barrier collar for interconnects | Rajesh Katkar | 2023-07-04 |
| 11658173 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2023-05-23 |
| 11652083 | Processed stacked dies | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2023-05-16 |
| 11552041 | Chemical mechanical polishing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Jeremy Alfred Theil | 2023-01-10 |
| 11515279 | Low temperature bonded structures | Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2022-11-29 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-08-16 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Belgacem Haba +1 more | 2022-07-19 |
| 11367652 | Microelectronic assembly from processed substrate | Laura Wills Mirkarimi | 2022-06-21 |
| 11348898 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2022-05-31 |
| 11348801 | Processing stacked substrates | Guilian Gao | 2022-05-31 |
| 11329034 | Direct-bonded LED structure contacts and substrate contacts | Min Tao, Liang Wang, Rajesh Katkar | 2022-05-10 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2022-04-05 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr. +1 more | 2022-04-05 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-02-22 |
| 11244920 | Method and structures for low temperature device bonding | — | 2022-02-08 |
| 11244916 | Low temperature bonded structures | Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2022-02-08 |
| 11195748 | Interconnect structures and methods for forming same | Laura Wills Mirkarimi | 2021-12-07 |
| 11158573 | Interconnect structures | Gaius Gillman Fountain, Jr., Jeremy Alfred Theil | 2021-10-26 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2021-10-26 |