Issued Patents All Time
Showing 26–50 of 404 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113056 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2024-10-08 |
| 12100676 | Low temperature bonded structures | Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-09-24 |
| 12087629 | Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon | — | 2024-09-10 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Laura Wills Mirkarimi, Javier A. Delacruz, Rajesh Katkar, Guilian Gao +1 more | 2024-09-03 |
| 12068278 | Processed stacked dies | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2024-08-20 |
| 12051621 | Microelectronic assembly from processed substrate | Laura Wills Mirkarimi | 2024-07-30 |
| 12046571 | Low temperature bonded structures | Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-07-23 |
| 12033943 | Laterally unconfined structure | — | 2024-07-09 |
| 12027487 | Structures for low temperature bonding using nanoparticles | — | 2024-07-02 |
| 12009338 | Dimension compensation control for directly bonded structures | Guilian Gao, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2024-06-11 |
| 11999001 | Advanced device assembly structures and methods | — | 2024-06-04 |
| RE49987 | Multiple plated via arrays of different wire heights on a same substrate | Rajesh Katkar | 2024-05-28 |
| 11973056 | Methods for low temperature bonding using nanoparticles | — | 2024-04-30 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr. +1 more | 2024-04-23 |
| 11955393 | Structures for bonding elements including conductive interface features | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr. | 2024-04-09 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Belgacem Haba +1 more | 2024-04-09 |
| 11908739 | Flat metal features for microelectronics applications | — | 2024-02-20 |
| 11894326 | Multi-metal contact structure | Rajesh Katkar | 2024-02-06 |
| 11862604 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2024-01-02 |
| 11855064 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2023-12-26 |
| 11837582 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-12-05 |
| 11837596 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2023-12-05 |
| 11764189 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2023-09-19 |
| 11756880 | Interconnect structures | Gaius Gillman Fountain, Jr., Jeremy Alfred Theil | 2023-09-12 |