Issued Patents All Time
Showing 226–250 of 270 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7658790 | Concentrated electroless solution for selective deposition of cobalt-based capping/barrier layers | Alexander Gorer, Chi-I Lang | 2010-02-09 |
| 7629198 | Methods for forming nonvolatile memory elements with resistive-switching metal oxides | Nitin Kumar, Jinhong Tong, Chi-I Lang, Prashant B. Phatak | 2009-12-08 |
| 7601393 | Controlling the temperature of a substrate in a film deposition apparatus | Karl Leeser | 2009-10-13 |
| 7589016 | Method of depositing a sculptured copper seed layer | Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2009-09-15 |
| 7544398 | Controlled nano-doping of ultra thin films | Jane Chang, Trinh Tu Van, Chandra Deshpandey, Karl Lesser | 2009-06-09 |
| 7544574 | Methods for discretized processing of regions of a substrate | David E. Lazovsky, Thomas R. Boussie, Alexander Gorer | 2009-06-09 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2008-06-03 |
| 7348042 | Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2008-03-25 |
| 7318869 | Variable gas conductance control for a process chamber | Karl Leeser, Jeffrey A. Brown, Jason Babcoke | 2008-01-15 |
| 7309658 | Molecular self-assembly in substrate processing | David E. Lazovsky, Majid Keshavarz | 2007-12-18 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 7189432 | Varying conductance out of a process region to control gas flux in an ALD reactor | Karl Leeser, Jeffrey A. Brown, Jason Babcoke | 2007-03-13 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2006-07-11 |
| 6992012 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Barry Chin | 2006-01-31 |
| 6949450 | Method for integrated in-situ cleaning and subsequent atomic layer deposition within a single processing chamber | Karl Leeser | 2005-09-27 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6893541 | Multi-step process for depositing copper seed layer in a via | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6887353 | Tailored barrier layer which provides improved copper interconnect electromigration resistance | Peijun Ding, Barry Chin | 2005-05-03 |
| 6878402 | Method and apparatus for improved temperature control in atomic layer deposition | Karl Leeser | 2005-04-12 |
| 6800173 | Variable gas conductance control for a process chamber | Karl Leeser, Jeffrey A. Brown, Jason Babcoke | 2004-10-05 |
| 6793779 | Sputtering method for filling holes with copper | Peijun Ding, Barry Chin | 2004-09-21 |
| 6790776 | Barrier layer for electroplating processes | Peijun Ding, Tse-Yong Yao, Barry Chin | 2004-09-14 |
| 6758947 | Damage-free sculptured coating deposition | Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2004-07-06 |
| 6709987 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Barry Chin | 2004-03-23 |
| 6630201 | Adsorption process for atomic layer deposition | Karl Leeser, Jeffrey A. Brown, Jason Babcoke | 2003-10-07 |