Issued Patents All Time
Showing 251–270 of 270 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627050 | Method and apparatus for depositing a tantalum-containing layer on a substrate | Michael Miller, Peijun Ding, Howard H. Tang, Jianming Fu | 2003-09-30 |
| 6605197 | Method of sputtering copper to fill trenches and vias | Peijun Ding, Barry Chin | 2003-08-12 |
| 6582569 | Process for sputtering copper in a self ionized plasma | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2003-06-24 |
| 6569501 | Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2003-05-27 |
| 6559061 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Barry Chin | 2003-05-06 |
| 6488823 | Stress tunable tantalum and tantalum nitride films | Peijun Ding, Barry Chin, Bingxi Sun | 2002-12-03 |
| 6458255 | Ultra-low resistivity tantalum films and methods for their deposition | Peijun Ding, Barry Chin | 2002-10-01 |
| 6428859 | Sequential method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2002-08-06 |
| 6416822 | Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD) | Karl Leeser | 2002-07-09 |
| 6413383 | Method for igniting a plasma in a sputter reactor | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-07-02 |
| 6398929 | Plasma reactor and shields generating self-ionized plasma for sputtering | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2002-06-04 |
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun, Barry Chin | 2002-05-14 |
| 6328871 | Barrier layer for electroplating processes | Peijun Ding, Tse-Yong Yao, Barry Chin | 2001-12-11 |
| 6313033 | Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications | Bingxi Sun, Suraj Rengarajan, Peijun Ding, Barry Chin | 2001-11-06 |
| 6287977 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Barry Chin | 2001-09-11 |
| 6160315 | Copper alloy via structure | Peijun Ding, Barry Chin, Imran Hashim, Bingxi Sun | 2000-12-12 |
| 6139699 | Sputtering methods for depositing stress tunable tantalum and tantalum nitride films | Peijun Ding, Barry Chin | 2000-10-31 |
| 6066892 | Copper alloy seed layer for copper metallization in an integrated circuit | Peijun Ding, Imran Hashim, Bingxi Sun, Barry Chin | 2000-05-23 |
| 6057237 | Tantalum-containing barrier layers for copper | Peijun Ding | 2000-05-02 |
| 6037257 | Sputter deposition and annealing of copper alloy metallization | Peijun Ding, Barry Chin, Imran Hashim, Bingxi Sun | 2000-03-14 |