Issued Patents All Time
Showing 76–100 of 126 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9875748 | Audio signal noise attenuation | — | 2018-01-23 |
| 9817846 | Content selection algorithms | Houssam Nassif, Vijai Mohan, Vishwanathan Swaminathan, Mitchell Howard Goodman | 2017-11-14 |
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Leonel Arana, Gregory S. Constable | 2017-11-07 |
| 9787846 | Spatial audio signal processing for objects with associated audio content | Ryan S. Menezes, Shawn Crispin Wright, Hongwu Huai | 2017-10-10 |
| 9766327 | Controlling transmission of pulses from a sensor | Ashish Vijay Pandharipande, David Ricardo Caicedo Fernandez | 2017-09-19 |
| 9659574 | Signal noise attenuation | Patrick Kechichian | 2017-05-23 |
| 9601848 | Vertical socket contact with flat force response | Joshua D. Heppner | 2017-03-21 |
| 9596549 | Audio system and method of operation therefor | Ashish Vijay Pandharipande | 2017-03-14 |
| 9572258 | Method of forming a substrate core with embedded capacitor and structures formed thereby | John S. Guzek, Cengiz A. Palanduz, Victor Prokofiev, Joel Auernheimer | 2017-02-14 |
| 9542656 | Supporting ETL processing in BPEL-based processes | Marion Behnen, Qi Jin, Yannick Saillet, Muthukumar Thirunavukkarasu, Hoi-Jun Yoo | 2017-01-10 |
| 9508358 | Noise reduction system with remote noise detector | — | 2016-11-29 |
| 9461431 | Mechanism for facilitating and employing a magnetic grid array | Gregorio R. Murtagian, Bhanu Jaiswal, Michael J. Hill | 2016-10-04 |
| 9461014 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Ram Viswanath, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan | 2016-10-04 |
| 9426155 | Extending infrastructure security to services in a cloud computing environment | Ching-Yun Chao, John Y. Chang, Paul W. Bennett, John Sanchez, Donald R. Woods +3 more | 2016-08-23 |
| 9391013 | 3D integrated circuit package with window interposer | Debendra Mallik, Ram Viswanath, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam | 2016-07-12 |
| 9361137 | Managing application parameters based on parameter types | Marion Behnen, Sameer V. Jorapur, Muthukumar Thirunavukkarasu, Cheung-Yuk Wu | 2016-06-07 |
| 9286223 | Merging demand load requests with prefetch load requests | Tarun Nakra | 2016-03-15 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Leonel Arana, Gregory S. Constable | 2016-02-09 |
| 9172160 | Vertical socket contact with flat force response | Joshua D. Heppner | 2015-10-27 |
| 9129958 | 3D integrated circuit package with window interposer | Debendra Mallik, Ram Viswanath, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam | 2015-09-08 |
| 9118143 | Mechanism for facilitating and employing a magnetic grid array | Gregorio R. Murtagian, Bhanu Jaiswal, Michael J. Hill | 2015-08-25 |
| 9064971 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Ram Viswanath, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan | 2015-06-23 |
| 8903762 | Modeling data exchange in a data flow of an extract, transform, and load (ETL) process | Qi Jin, Hui-Fen Liao, Lin Xu | 2014-12-02 |
| 8726679 | Dedicated pulsing valve for compressor cylinder | Alexander Lifson, Paul J. Flanigan | 2014-05-20 |
| 8659171 | Patch on interposer assembly and structures formed thereby | Brent M. Roberts, Mihir K. Roy | 2014-02-25 |