Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9040842 | Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers | Omar J. Bchir, Houssam Jomaa | 2015-05-26 |
| 8901724 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Javier Soto Gonzalez, Nicholas R. Watts | 2014-12-02 |
| 8896116 | Microelectronic package and method of manufacturing same | Mathew J. Manusharow, Drew W. Delaney | 2014-11-25 |
| 8809124 | Bumpless build-up layer and laminated core hybrid structures and methods of assembling same | Mathew J. Manusharow, Mark S. Hlad | 2014-08-19 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney, Suresh Pothukuchi, Mohit Mamodia +2 more | 2014-07-22 |
| 8772924 | Forming in-situ micro-feature structures with coreless packages | Mathew J. Manusharow | 2014-07-08 |
| 8618652 | Forming functionalized carrier structures with coreless packages | John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney, Hamid Azimi | 2013-12-31 |
| 8580616 | Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby | Mathew J. Manusharow, Pramod Malatkar | 2013-11-12 |
| 8507324 | Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages | Drew W. Delaney | 2013-08-13 |
| 8508037 | Bumpless build-up layer and laminated core hybrid structures and methods of assembling same | Mathew J. Manusharow, Mark S. Hlad | 2013-08-13 |
| 8431438 | Forming in-situ micro-feature structures with coreless packages | Mathew J. Manusharow | 2013-04-30 |
| 8425785 | Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers | Omar J. Bchir, Houssain Jomas | 2013-04-23 |
| 8319318 | Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages | Drew W. Delaney | 2012-11-27 |
| 8304913 | Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby | Pramod Malatkar, Mathew J. Manusharow | 2012-11-06 |
| 8252677 | Method of forming solder bumps on substrates | Omar J. Bchir | 2012-08-28 |
| 8183692 | Barrier layer for fine-pitch mask-based substrate bumping | Christine H. Tsau, Mark S. Hlad | 2012-05-22 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2011-07-26 |
| 7831115 | Optical die structures and associated package substrates | Omar J. Bchir, Islam A. Salama, Charan Gurumurthy, Houssam Jomaa | 2010-11-09 |
| 7825022 | Method of enabling solder deposition on a substrate and electronic package formed thereby | Charavana K. Gurumurthy | 2010-11-02 |
| 7776734 | Barrier layer for fine-pitch mask-based substrate bumping | Christine H. Tsau, Mark S. Hlad | 2010-08-17 |
| 7651021 | Microball attachment using self-assembly for substrate bumping | Lakshmi Supriya | 2010-01-26 |
| 7583871 | Substrates for optical die structures | Omar J. Bchir, Islam A. Salama, Charan Gurumurthy, Houssam Jomaa, Yonggang Li | 2009-09-01 |
| 7538429 | Method of enabling solder deposition on a substrate and electronic package formed thereby | Charavana K. Gurumurthy | 2009-05-26 |
| 7494913 | Microball placement solutions | Houssam Jomaa, H. Ryan Chase | 2009-02-24 |