Issued Patents All Time
Showing 26–50 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721677 | Microelectronic assemblies having an integrated capacitor | Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-08-08 |
| 11719883 | Integrated GaAs active devices with improved optical coupling to dielectric waveguides | Minh Tran, Tin Komljenovic, Hyun Dai Park | 2023-08-08 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu +2 more | 2023-07-18 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Ying Wang, Junnan Zhao, Cheng Xu, Yikang Deng | 2023-07-04 |
| 11646254 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Cheng Xu, Junnan Zhao | 2023-05-09 |
| 11640934 | Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate | Meizi Jiao, Hongxia Feng, Kevin Thomas McCarthy | 2023-05-02 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-01-17 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Ying Wang | 2023-01-10 |
| 11527483 | Package including fully integrated voltage regulator circuitry within a substrate | Krishna Bharath | 2022-12-13 |
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more | 2022-12-06 |
| 11507340 | Audio output method, electronic device, and storage medium | Ning Ding, Zhen Liu | 2022-11-22 |
| 11500153 | Multi-chip packaging of silicon photonics | Roy Meade, Haiwei Lu, Chen Li | 2022-11-15 |
| 11493663 | Aerial-and-ground data combined gravity conversion method and system | Qingtian Lyu, Jiayong Yan, Guixiang Meng, Yitao Pu, Hanging Qiao | 2022-11-08 |
| 11480734 | Active-passive photonic integrated circuit platform | Hyundai Park, Tin Komljenovic, Minh Tran | 2022-10-25 |
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Yikang Deng +3 more | 2022-10-25 |
| D965209 | LED light panel | Chaoqun Zhou | 2022-09-27 |
| 11444042 | Magnetic structures in integrated circuit packages | Andrew J. Brown, Ying Wang, Lauren A. Link, Yikang Deng | 2022-09-13 |
| 11433419 | Draw device, draw equipment, and coating system | — | 2022-09-06 |
| 11422322 | Hybrid multi-wavelength source and associated methods | Michael Davenport, Mark Wade | 2022-08-23 |
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11322290 | Techniques for an inductor at a first level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram +3 more | 2022-05-03 |
| 11287573 | Heterogeneously integrated photonic devices with improved optical coupling between waveguides | Hyun Dai Park, Minh Tran, Tin Komljenovic | 2022-03-29 |
| D945350 | Underwater robot | Meizhao Zhang | 2022-03-08 |
| 11246218 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Ying Wang, Junnan Zhao, Cheng Xu, Yikang Deng | 2022-02-08 |
| 11217473 | Peeling device | Yen-Sheng Lin, Jun Wan | 2022-01-04 |