Issued Patents All Time
Showing 25 most recent of 134 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416763 | Fiber attach enabled wafer level fanout | Shahab Ardalan, Michael Davenport | 2025-09-16 |
| 12412745 | Electronic systems including two-dimensional material structures | Sumeet C. Pandey | 2025-09-09 |
| 12321022 | Apparatus for optical fiber-to-photonic chip connection and associated methods | Mark Wade, Chen Sun, John Fini, Vladimir Stojanovic, Alexandra Wright | 2025-06-03 |
| 12313891 | Thermal management system for multi-chip-module and associated methods | Vladimir Stojanovic | 2025-05-27 |
| 12313920 | Optical device configured for stress mitigation | Mian Zhang, Kevin Luke, Prashanta Kharel, Christian Reimer, Fan Ye | 2025-05-27 |
| 12306481 | Diffusion barrier layer in lithium niobate-containing photonic devices | Kevin Luke, Mian Zhang, Christian Reimer | 2025-05-20 |
| 12174419 | Thin film lithium niobate hybrid photonics packaging | Mian Zhang, Christian Reimer | 2024-12-24 |
| 12092880 | Beam steering structure with integrated polarization splitter | John Fini, Derek Van Orden, Mark Wade | 2024-09-17 |
| 12057332 | Wafer-level etching methods for planar photonics circuits and devices | Chen Sun, Mark Wade, Alexandra Wright, Vladimir Stojanovic | 2024-08-06 |
| 12019269 | Multi-chip packaging of silicon photonics | Chong Zhang, Haiwei Lu, Chen Li | 2024-06-25 |
| 12014962 | Systems and methods for wafer-level photonic testing | Anatol Khilo, Forrest Sedgwick, Alexandra Wright | 2024-06-18 |
| 11994724 | Chip-to-chip optical data communication system | Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram +2 more | 2024-05-28 |
| 11916602 | Remote memory architectures enabled by monolithic in-package optical i/o | Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard | 2024-02-27 |
| 11899251 | Vertical integrated photonics chiplet for in-package optical interconnect | Chong Zhang | 2024-02-13 |
| 11867944 | Photonic systems to enable top-side wafer-level optical and electrical test | Chen Sun, Shahab Ardalan, John Fini, Forrest Sedgwick | 2024-01-09 |
| 11823990 | Chip-last wafer-level fan-out with optical fiber alignment structure | — | 2023-11-21 |
| 11822128 | Fiber attach enabled wafer level fanout | Shahab Ardalan, Michael Davenport | 2023-11-21 |
| 11799554 | Laser module for optical data communication system within silicon interposer | Chen Sun, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram +3 more | 2023-10-24 |
| 11777633 | Optical multiplexer/demultiplexer module and associated methods | Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade | 2023-10-03 |
| 11705972 | Pooled memory system enabled by monolithic in-package optical I/O | Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard | 2023-07-18 |
| 11694935 | Systems and methods for wafer-level photonic testing | Anatol Khilo, Forrest Sedgwick, Alexandra Wright | 2023-07-04 |
| 11563506 | Electro-optical interface module and associated methods | Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade | 2023-01-24 |
| 11536915 | Methods and systems for hermetically sealed fiber to chip connections | Gurtej S. Sandhu | 2022-12-27 |
| 11500153 | Multi-chip packaging of silicon photonics | Chong Zhang, Haiwei Lu, Chen Li | 2022-11-15 |
| 11493708 | Thermal management system for multi-chip-module and associated methods | Vladimir Stojanovic | 2022-11-08 |