| 12512402 |
Chip-last wafer-level fan-out with optical fiber alignment structure |
— |
2025-12-30 |
|
| 12487402 |
Double blade dicing of lithium-containing photonics devices |
Fangke Ye, Yingrui WANG |
2025-12-02 |
|
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Planar fiber shuffle |
— |
2025-10-14 |
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| 12416763 |
Fiber attach enabled wafer level fanout |
Shahab Ardalan, Michael Davenport |
2025-09-16 |
|
| 12412745 |
Electronic systems including two-dimensional material structures |
Sumeet C. Pandey |
2025-09-09 |
|
| 12321022 |
Apparatus for optical fiber-to-photonic chip connection and associated methods |
Mark Wade, Chen Sun, John Fini, Vladimir Stojanovic, Alexandra Wright |
2025-06-03 |
|
| 12313920 |
Optical device configured for stress mitigation |
Mian Zhang, Kevin Luke, Prashanta Kharel, Christian Reimer, Fan Ye |
2025-05-27 |
|
| 12313891 |
Thermal management system for multi-chip-module and associated methods |
Vladimir Stojanovic |
2025-05-27 |
|
| 12306481 |
Diffusion barrier layer in lithium niobate-containing photonic devices |
Kevin Luke, Mian Zhang, Christian Reimer |
2025-05-20 |
|
| 12174419 |
Thin film lithium niobate hybrid photonics packaging |
Mian Zhang, Christian Reimer |
2024-12-24 |
|
| 12092880 |
Beam steering structure with integrated polarization splitter |
John Fini, Derek Van Orden, Mark Wade |
2024-09-17 |
|
| 12057332 |
Wafer-level etching methods for planar photonics circuits and devices |
Chen Sun, Mark Wade, Alexandra Wright, Vladimir Stojanovic |
2024-08-06 |
|
| 12019269 |
Multi-chip packaging of silicon photonics |
Chong Zhang, Haiwei Lu, Chen Li |
2024-06-25 |
|
| 12014962 |
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Anatol Khilo, Forrest Sedgwick, Alexandra Wright |
2024-06-18 |
|
| 11994724 |
Chip-to-chip optical data communication system |
Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram +2 more |
2024-05-28 |
|
| 11916602 |
Remote memory architectures enabled by monolithic in-package optical i/o |
Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard |
2024-02-27 |
|
| 11899251 |
Vertical integrated photonics chiplet for in-package optical interconnect |
Chong Zhang |
2024-02-13 |
|
| 11867944 |
Photonic systems to enable top-side wafer-level optical and electrical test |
Chen Sun, Shahab Ardalan, John Fini, Forrest Sedgwick |
2024-01-09 |
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| 11823990 |
Chip-last wafer-level fan-out with optical fiber alignment structure |
— |
2023-11-21 |
|
| 11822128 |
Fiber attach enabled wafer level fanout |
Shahab Ardalan, Michael Davenport |
2023-11-21 |
|
| 11799554 |
Laser module for optical data communication system within silicon interposer |
Chen Sun, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram +3 more |
2023-10-24 |
|
| 11777633 |
Optical multiplexer/demultiplexer module and associated methods |
Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade |
2023-10-03 |
|
| 11705972 |
Pooled memory system enabled by monolithic in-package optical I/O |
Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard |
2023-07-18 |
|
| 11694935 |
Systems and methods for wafer-level photonic testing |
Anatol Khilo, Forrest Sedgwick, Alexandra Wright |
2023-07-04 |
|
| 11563506 |
Electro-optical interface module and associated methods |
Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade |
2023-01-24 |
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