Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385177 | Technique for fabrication of microelectronic capacitors and resistors | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2016-07-05 |
| 9373561 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Vincent J. McGahay, Joyeeta Nag | 2016-06-21 |
| 9362230 | Methods to form conductive thin film structures | Lawrence A. Clevenger, Vincent J. McGahay, Joyeeta Nag | 2016-06-07 |
| 9337087 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Byoung Youp Kim, Walter Kleemeier | 2016-05-10 |
| 9324793 | Method for controlling the profile of an etched metallic layer | Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Edem Wornyo, John H. Zhang | 2016-04-26 |
| 9240375 | Modular fuses and antifuses for integrated circuits | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2016-01-19 |
| 9214429 | Trench interconnect having reduced fringe capacitance | John H. Zhang, Hsueh-Chung Chen, Lawrence A. Clevenger, Yann Mignot, Carl Radens +2 more | 2015-12-15 |
| 9209036 | Method for controlling the profile of an etched metallic layer | Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Edem Wornyo, John H. Zhang | 2015-12-08 |
| 9082625 | Patterning through imprinting | Lawrence A. Clevenger, Carl Radens, Richard S. Wise, John H. Zhang | 2015-07-14 |
| 9018092 | Encapsulated metal interconnect | John H. Zhang, Lawrence A. Clevenger, Carl Radens | 2015-04-28 |
| 9018097 | Semiconductor device processing with reduced wiring puddle formation | Thomas W. Dyer, Hanako Henry, Tze-man Ko, Shaoning Yao | 2015-04-28 |
| 8970004 | Electrostatic discharge devices for integrated circuits | John H. Zhang, Lawrence A. Clevenger, Carl Radens | 2015-03-03 |
| 8921976 | Using backside passive elements for multilevel 3D wafers alignment applications | John H. Zhang, Lawrence A. Clevenger | 2014-12-30 |
| 8900990 | System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Walter Kleemeier, Cindy Goldberg | 2014-12-02 |
| 8889506 | Structure and method for interconnect spatial frequency doubling using selective ridges | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2014-11-18 |
| 8859350 | Recessed gate field effect transistor | John H. Zhang, Carl Radens, Lawrence A. Clevenger | 2014-10-14 |
| 8829670 | Through silicon via structure for internal chip cooling | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2014-09-09 |
| 8685850 | System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections | John H. Zhang, Lawrence A. Clevenger, Carl Radens | 2014-04-01 |
| 8680577 | Recessed gate field effect transistor | John H. Zhang, Lawrence A. Clevenger, Carl Radens | 2014-03-25 |
| 8623673 | Structure and method for detecting defects in BEOL processing | Thomas W. Dyer, Tze-man Ko, Shaoning Yao | 2014-01-07 |
| 8395228 | Integration process to improve focus leveling within a lot process variation | Wai-Kin Li, Wu-Song Huang, Dario L. Goldfarb, Martin Glodde, Edward R. Engbrecht | 2013-03-12 |
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu +5 more | 2011-09-27 |
| 7570174 | Real time alarm classification and method of use | Joseph Byrne, Harry D. Clark, Gary R. Moore, Michael L. Passow | 2009-08-04 |